5CSEBA4U19C7N vs 5CSEBA4U19A7N Vergleich
Detaillierter Direktvergleich von 5CSEBA4U19C7N von Intel und 5CSEBA4U19A7N von Intel. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
Intel
5CSEBA4U19C7N - Cyclone V SE SoC FPGA, 40K LE, Dual ARM Cortex-A9 | Intel
5CSEBA4U19C7N ✓ AktivSpezifikationsvergleich
| Parameter | 5CSEBA4U19C7N | 5CSEBA4U19A7N |
|---|---|---|
| Marke | Intel | Intel |
| Kategorie | FPGA & CPLD | FPGA & CPLD |
| Lebenszyklusstatus | Aktiv | Aktiv |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $36,92 | $99,90 |
| Series | Cyclone V SE SoC FPGA | — |
| Family | 5CSEBA4 (U19 device) | Cyclone V SE SoC FPGA |
| Logic Elements | 40 K | 40 K |
| HPS Cores | Dual ARM Cortex-A9 MPCore with CoreSight | — |
| HPS Max Frequency | 800 MHz | — |
| DSP Blocks | Variable-precision DSP (number not specified in data) | — |
| Embedded Memory | [DATA_NEEDED: total Kbits of embedded RAM] | 3.4 Mbits (M9K) |
| Embedded Multipliers | 56 (18x18) | — |
| PLLs | 4 | [DATA_NEEDED: PLL count] |
| Hard Memory Controllers | 2 | — |
| Hard USB 2.0 OTG | Yes | — |
| Hard PCIe Gen2 | Yes (rootport/endpoint configurable) | — |
| Core Voltage | 1.1 V | 1.1 V (typical) |
| Process Technology | 28 nm low-power | — |
| Betriebstemperatur | 0 C to +85 C (commercial) | — |
| Gehäuse | 484-pin UBG A (UBGA), 19x19 mm | 484-UBGA (U19), 19x19 mm, 1.0 mm pitch |
| AES Encryption | Supported | — |
| SEU Error Detection/Correction | Supported | — |
| Configuration Interface | JTAG | — |
| RoHS-Status | Compliant | Compliant |
| Hard Processor System | — | Dual ARM Cortex-A9 MPCore with CoreSight |
| Adaptive Logic Modules | — | [DATA_NEEDED: ALM count] |
| DSP Blocks (18x18 Multipliers) | — | 224 |
| HPS Maximum Application Clock | — | 925 MHz |
| Memory Interfaces | — | DDR3, DDR3L, LPDDR2 (via HPS); soft DDR3/2 in FPGA |
| User I/O | — | 161 |
| Montageart | — | Surface Mount (BGA) |
| Betriebs-Sperrschichttemperatur | — | -40C to +125C (automotive) / -40C to +100C (industrial) |
| Process Node | — | TSMC 28 nm low-power |
| MSL-Level | — | 3 (168 hours) |