5CSEBA4U19C7N vs 5CSEBA4U19A7N Comparación
Comparación detallada lado a lado de 5CSEBA4U19C7N por Intel y 5CSEBA4U19A7N por Intel. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
Intel
5CSEBA4U19C7N - Cyclone V SE SoC FPGA, 40K LE, Dual ARM Cortex-A9 | Intel
5CSEBA4U19C7N ✓ ActivoComparación de especificaciones
| Parámetro | 5CSEBA4U19C7N | 5CSEBA4U19A7N |
|---|---|---|
| Marca | Intel | Intel |
| Categoría | FPGA & CPLD | FPGA & CPLD |
| Estado del ciclo de vida | Activo | Activo |
| Estado del stock | In Stock | In Stock |
| Precio unitario (USD) | $36,92 | $99,90 |
| Series | Cyclone V SE SoC FPGA | — |
| Family | 5CSEBA4 (U19 device) | Cyclone V SE SoC FPGA |
| Logic Elements | 40 K | 40 K |
| HPS Cores | Dual ARM Cortex-A9 MPCore with CoreSight | — |
| HPS Max Frequency | 800 MHz | — |
| DSP Blocks | Variable-precision DSP (number not specified in data) | — |
| Embedded Memory | [DATA_NEEDED: total Kbits of embedded RAM] | 3.4 Mbits (M9K) |
| Embedded Multipliers | 56 (18x18) | — |
| PLLs | 4 | [DATA_NEEDED: PLL count] |
| Hard Memory Controllers | 2 | — |
| Hard USB 2.0 OTG | Yes | — |
| Hard PCIe Gen2 | Yes (rootport/endpoint configurable) | — |
| Core Voltage | 1.1 V | 1.1 V (typical) |
| Process Technology | 28 nm low-power | — |
| Temperatura de funcionamiento | 0 C to +85 C (commercial) | — |
| Encapsulado | 484-pin UBG A (UBGA), 19x19 mm | 484-UBGA (U19), 19x19 mm, 1.0 mm pitch |
| AES Encryption | Supported | — |
| SEU Error Detection/Correction | Supported | — |
| Configuration Interface | JTAG | — |
| Estado RoHS | Compliant | Compliant |
| Hard Processor System | — | Dual ARM Cortex-A9 MPCore with CoreSight |
| Adaptive Logic Modules | — | [DATA_NEEDED: ALM count] |
| DSP Blocks (18x18 Multipliers) | — | 224 |
| HPS Maximum Application Clock | — | 925 MHz |
| Memory Interfaces | — | DDR3, DDR3L, LPDDR2 (via HPS); soft DDR3/2 in FPGA |
| User I/O | — | 161 |
| Tipo de montaje | — | Surface Mount (BGA) |
| Temperatura de unión de funcionamiento | — | -40C to +125C (automotive) / -40C to +100C (industrial) |
| Process Node | — | TSMC 28 nm low-power |
| Nivel MSL | — | 3 (168 hours) |