EP2A25F672C9N vs EP2A25F672C8N तुलना
विस्तृत दोनों ओर की तुलना EP2A25F672C9N द्वारा Intel और EP2A25F672C8N द्वारा Intel. मुख्य विशेषताओं, इलेक्ट्रिकल पैरामीटर, पैकेजिंग, चक्र स्थिति, मूल्यांकन और उपलब्धता को तुलना करके अपनी डिजाइन की आवश्यकताओं के लिए सबसे अच्छा घटक निर्धारित करें。
विशेषता तुलना
| पैरामीटर | EP2A25F672C9N | EP2A25F672C8N |
|---|---|---|
| ब्रांड | Intel | Intel |
| श्रेणी | FPGA & CPLD | FPGA & CPLD |
| लाइफसाइकिल स्थिति | Obsolete | NRND |
| Family | APEX II | APEX II |
| Logic Elements / Cells | 24320 | 24,320 |
| System Gates | Approx. 900000 | 900,000 |
| Maximum User I/O | 492 | — |
| Operating Frequency | 236 MHz | — |
| Core Supply Voltage (VCCINT) | 1.425 V to 1.575 V (nominal 1.5 V) | — |
| Process Technology | 0.15 µm all-layer copper, up to 8 metal layers | — |
| पैकेज | 672-ball FineLine BGA (F672), 27 × 27 mm, 1.00 mm pitch | 672-ball FC-FBGA (FineLine BGA) |
| माउंटिंग प्रकार | Surface Mount (BGA) | Surface Mount |
| Seated Height (max) | 2.100 mm | — |
| Propagation Delay | 2.23 ns | 1.69 ns |
| Logic Family | CMOS | — |
| ऑपरेटिंग तापमान | 0 °C to +85 °C (commercial, C9 grade) | 0 C to 85 C (commercial) |
| I/O Standards Supported | LVTTL, LVCMOS, PCI, GTL+, SSTL-2/3, LVDS, LVPECL, PCML, HyperTransport | — |
| LVDS Data Rate | Up to 1 Gbps (True-LVDS) | — |
| Configuration Interface | Serial / Parallel PROM, JTAG, passive parallel (enhanced) | — |
| Embedded Memory | Enhanced System Blocks (ESBs) for dual-port RAM | — |
| Design Software | Quartus II (v5.1 or later) | — |
| RoHS स्थिति | Compliant (per distributor listings) | Compliant |
| Technology Node | — | 0.15 um all-layer copper process |
| Maximum Internal Frequency | — | 333 MHz |
| User I/Os | — | 492 |
| Package Body Size | — | 27 x 27 mm |
| Ball Pitch | — | 1.0 mm |
| Core Supply Voltage | — | 1.5 V |
| Speed Grade | — | C8 |
| Multi-Gigabit Transceiver Rate | — | Up to 1 Gbps per channel |
| Lead-Free Suffix | — | N (lead-free, Pb-free finish) |