EP2A25F672C9N vs EP2A25F672C8N Pengandingan
Pengandingan Sisi Kiri Sisi Kanan Terperinci EP2A25F672C9N disebabkan oleh Intel dan EP2A25F672C8N disebabkan oleh Intel. Bandingkan spesifikasi utama, parameter elektrik, pakej, status kehidupan, harga, dan keupayaan untuk menentukan komponen terbaik untuk keperluan disenjaya anda.
Pengandingan Spesifikasi
| Parametr | EP2A25F672C9N | EP2A25F672C8N |
|---|---|---|
| Merek | Intel | Intel |
| Kategori | FPGA & CPLD | FPGA & CPLD |
| Status Lingkungan Hidup | Obsolete | NRND |
| Family | APEX II | APEX II |
| Logic Elements / Cells | 24320 | 24,320 |
| System Gates | Approx. 900000 | 900,000 |
| Maximum User I/O | 492 | — |
| Operating Frequency | 236 MHz | — |
| Core Supply Voltage (VCCINT) | 1.425 V to 1.575 V (nominal 1.5 V) | — |
| Process Technology | 0.15 µm all-layer copper, up to 8 metal layers | — |
| Kemasan | 672-ball FineLine BGA (F672), 27 × 27 mm, 1.00 mm pitch | 672-ball FC-FBGA (FineLine BGA) |
| Jenis Pemasangan | Surface Mount (BGA) | Surface Mount |
| Seated Height (max) | 2.100 mm | — |
| Propagation Delay | 2.23 ns | 1.69 ns |
| Logic Family | CMOS | — |
| Suhu Operasi | 0 °C to +85 °C (commercial, C9 grade) | 0 C to 85 C (commercial) |
| I/O Standards Supported | LVTTL, LVCMOS, PCI, GTL+, SSTL-2/3, LVDS, LVPECL, PCML, HyperTransport | — |
| LVDS Data Rate | Up to 1 Gbps (True-LVDS) | — |
| Configuration Interface | Serial / Parallel PROM, JTAG, passive parallel (enhanced) | — |
| Embedded Memory | Enhanced System Blocks (ESBs) for dual-port RAM | — |
| Design Software | Quartus II (v5.1 or later) | — |
| Status RoHS | Compliant (per distributor listings) | Compliant |
| Technology Node | — | 0.15 um all-layer copper process |
| Maximum Internal Frequency | — | 333 MHz |
| User I/Os | — | 492 |
| Package Body Size | — | 27 x 27 mm |
| Ball Pitch | — | 1.0 mm |
| Core Supply Voltage | — | 1.5 V |
| Speed Grade | — | C8 |
| Multi-Gigabit Transceiver Rate | — | Up to 1 Gbps per channel |
| Lead-Free Suffix | — | N (lead-free, Pb-free finish) |