EP2AGZ300FF35I4G vs EP2AGZ300FF35C3G Comparison

Detailed side-by-side comparison of EP2AGZ300FF35I4G by Intel and EP2AGZ300FF35C3G by Intel. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.

Specification Comparison

Parameter EP2AGZ300FF35I4G EP2AGZ300FF35C3G
Brand Intel Intel
Category FPGA & CPLD FPGA & CPLD
Lifecycle Status Active Active
Stock Status In Stock In Stock
Unit Price (USD) $2,610.00 $1,395.00
Series Arria II GZ Arria II GZ
Family Name Arria II GZ FPGA β€”
Logic Elements (LE) 300,000 β€”
Adaptive Logic Modules (ALM) [DATA_NEEDED: ALM count] β€”
Embedded Memory (Bits) 18.16 Mbit β€”
DSP Blocks [DATA_NEEDED: DSP block count] 16-bit x 18-bit x 18-bit multipliers, integer/fractional modes
Maximum User I/O 554 β€”
Transceivers Up to 21 channels 16 channels, up to 6.375 Gbps
Transceiver Data Rate 8.55 Gbps β€”
Hard PCIe Controllers PCIe Gen1 and Gen2 Up to 12 (Gen2 endpoint/root-port)
Memory Interfaces DDR3, DDR2, QDRII+, QDRII SRAM up to 800 MHz β€”
PLLs Fractional PLLs on-chip β€”
Package 1152-FBGA (FF35) 35x35 mm FCBGA-1152 (35 mm)
Operating Temperature -40C to +100C (Industrial, I4 grade) β€”
Mounting Type Surface Mount β€”
MSL Level [DATA_NEEDED: MSL rating] β€”
RoHS Status Compliant Compliant
Process Node 40 nm β€”
Speed Grade 4 3 (mid-performance)
Logic Elements β€” 300,000
Adaptive Logic Modules (ALMs) β€” 119,088
Embedded Memory β€” 17,133 Kbit
User I/Os β€” 1,288
I/O Banks β€” 12
Process Technology β€” 40 nm TSMC
Package Family β€” BGA (Flip-Chip)
Temperature Grade β€” Commercial (0 C to 85 C junction)
Configuration Method β€” Quartus II/Prime, JTAG, Passive Serial, Fast Passive Parallel
Hard Memory Controller β€” DDR3 up to 800 MHz, DDR2, QDR II+

Datasheets & Resources

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