EP2AGZ300FF35I4G vs EP2AGZ300FF35C3G Perbandingan
Perbandingan bersamaan detil EP2AGZ300FF35I4G dari Intel dan EP2AGZ300FF35C3G dari Intel. Bandingkan spesifikasi penting, parameter listrik, pengemasan, status cycle, harga, dan ketersediaan untuk menentukan komponen terbaik untuk kebutuhan desain Anda.
Perbandingan Spesifikasi
| Parameter Umum | EP2AGZ300FF35I4G | EP2AGZ300FF35C3G |
|---|---|---|
| Merek | Intel | Intel |
| Kategori | FPGA & CPLD | FPGA & CPLD |
| Status Lingkungan Hidup | Aktif | Aktif |
| Series | Arria II GZ | Arria II GZ |
| Family Name | Arria II GZ FPGA | — |
| Logic Elements (LE) | 300,000 | — |
| Adaptive Logic Modules (ALM) | [DATA_NEEDED: ALM count] | — |
| Embedded Memory (Bits) | 18.16 Mbit | — |
| DSP Blocks | [DATA_NEEDED: DSP block count] | 16-bit x 18-bit x 18-bit multipliers, integer/fractional modes |
| Maximum User I/O | 554 | — |
| Transceivers | Up to 21 channels | 16 channels, up to 6.375 Gbps |
| Transceiver Data Rate | 8.55 Gbps | — |
| Hard PCIe Controllers | PCIe Gen1 and Gen2 | Up to 12 (Gen2 endpoint/root-port) |
| Memory Interfaces | DDR3, DDR2, QDRII+, QDRII SRAM up to 800 MHz | — |
| PLLs | Fractional PLLs on-chip | — |
| Paket | 1152-FBGA (FF35) 35x35 mm | FCBGA-1152 (35 mm) |
| Suhu Kerja | -40C to +100C (Industrial, I4 grade) | — |
| Tipe Mounting | Surface Mount | — |
| Level MSL | [DATA_NEEDED: MSL rating] | — |
| Status RoHS | Compliant | Compliant |
| Process Node | 40 nm | — |
| Speed Grade | 4 | 3 (mid-performance) |
| Logic Elements | — | 300,000 |
| Adaptive Logic Modules (ALMs) | — | 119,088 |
| Embedded Memory | — | 17,133 Kbit |
| User I/Os | — | 1,288 |
| I/O Banks | — | 12 |
| Process Technology | — | 40 nm TSMC |
| Package Family | — | BGA (Flip-Chip) |
| Temperature Grade | — | Commercial (0 C to 85 C junction) |
| Configuration Method | — | Quartus II/Prime, JTAG, Passive Serial, Fast Passive Parallel |
| Hard Memory Controller | — | DDR3 up to 800 MHz, DDR2, QDR II+ |