EP2AGZ300FF35I4G vs EP2AGZ300FF35C3G Pengandingan
Pengandingan Sisi Kiri Sisi Kanan Terperinci EP2AGZ300FF35I4G disebabkan oleh Intel dan EP2AGZ300FF35C3G disebabkan oleh Intel. Bandingkan spesifikasi utama, parameter elektrik, pakej, status kehidupan, harga, dan keupayaan untuk menentukan komponen terbaik untuk keperluan disenjaya anda.
Pengandingan Spesifikasi
| Parametr | EP2AGZ300FF35I4G | EP2AGZ300FF35C3G |
|---|---|---|
| Merek | Intel | Intel |
| Kategori | FPGA & CPLD | FPGA & CPLD |
| Status Lingkungan Hidup | Aktif | Aktif |
| Series | Arria II GZ | Arria II GZ |
| Family Name | Arria II GZ FPGA | — |
| Logic Elements (LE) | 300,000 | — |
| Adaptive Logic Modules (ALM) | [DATA_NEEDED: ALM count] | — |
| Embedded Memory (Bits) | 18.16 Mbit | — |
| DSP Blocks | [DATA_NEEDED: DSP block count] | 16-bit x 18-bit x 18-bit multipliers, integer/fractional modes |
| Maximum User I/O | 554 | — |
| Transceivers | Up to 21 channels | 16 channels, up to 6.375 Gbps |
| Transceiver Data Rate | 8.55 Gbps | — |
| Hard PCIe Controllers | PCIe Gen1 and Gen2 | Up to 12 (Gen2 endpoint/root-port) |
| Memory Interfaces | DDR3, DDR2, QDRII+, QDRII SRAM up to 800 MHz | — |
| PLLs | Fractional PLLs on-chip | — |
| Kemasan | 1152-FBGA (FF35) 35x35 mm | FCBGA-1152 (35 mm) |
| Suhu Operasi | -40C to +100C (Industrial, I4 grade) | — |
| Jenis Pemasangan | Surface Mount | — |
| Aras MSL | [DATA_NEEDED: MSL rating] | — |
| Status RoHS | Compliant | Compliant |
| Process Node | 40 nm | — |
| Speed Grade | 4 | 3 (mid-performance) |
| Logic Elements | — | 300,000 |
| Adaptive Logic Modules (ALMs) | — | 119,088 |
| Embedded Memory | — | 17,133 Kbit |
| User I/Os | — | 1,288 |
| I/O Banks | — | 12 |
| Process Technology | — | 40 nm TSMC |
| Package Family | — | BGA (Flip-Chip) |
| Temperature Grade | — | Commercial (0 C to 85 C junction) |
| Configuration Method | — | Quartus II/Prime, JTAG, Passive Serial, Fast Passive Parallel |
| Hard Memory Controller | — | DDR3 up to 800 MHz, DDR2, QDR II+ |