EP2AGZ300FF35I4G vs EP2AGZ300FF35C3G Ikinahambing

Detalyadong pagkakahiwalay na pagkakahambing ng EP2AGZ300FF35I4G sa pamamagitan ng Intel at EP2AGZ300FF35C3G sa pamamagitan ng Intel. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.

Pagsanggunian na paghahambing

Parametro EP2AGZ300FF35I4G EP2AGZ300FF35C3G
Brand Intel Intel
Kategorya FPGA & CPLD FPGA & CPLD
Katayuan ng Lifecycle Aktibo Aktibo
Series Arria II GZ Arria II GZ
Family Name Arria II GZ FPGA —
Logic Elements (LE) 300,000 —
Adaptive Logic Modules (ALM) [DATA_NEEDED: ALM count] —
Embedded Memory (Bits) 18.16 Mbit —
DSP Blocks [DATA_NEEDED: DSP block count] 16-bit x 18-bit x 18-bit multipliers, integer/fractional modes
Maximum User I/O 554 —
Transceivers Up to 21 channels 16 channels, up to 6.375 Gbps
Transceiver Data Rate 8.55 Gbps —
Hard PCIe Controllers PCIe Gen1 and Gen2 Up to 12 (Gen2 endpoint/root-port)
Memory Interfaces DDR3, DDR2, QDRII+, QDRII SRAM up to 800 MHz —
PLLs Fractional PLLs on-chip —
Packhaging 1152-FBGA (FF35) 35x35 mm FCBGA-1152 (35 mm)
Temperature na Operasyon -40C to +100C (Industrial, I4 grade) —
Uri ng Pagpapasok Surface Mount —
Level ng MSL [DATA_NEEDED: MSL rating] —
Tindminan RoHS Compliant Compliant
Process Node 40 nm —
Speed Grade 4 3 (mid-performance)
Logic Elements — 300,000
Adaptive Logic Modules (ALMs) — 119,088
Embedded Memory — 17,133 Kbit
User I/Os — 1,288
I/O Banks — 12
Process Technology — 40 nm TSMC
Package Family — BGA (Flip-Chip)
Temperature Grade — Commercial (0 C to 85 C junction)
Configuration Method — Quartus II/Prime, JTAG, Passive Serial, Fast Passive Parallel
Hard Memory Controller — DDR3 up to 800 MHz, DDR2, QDR II+

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