EP2AGZ300FH29C3G vs EP2AGZ300FH29I4G Pengandingan
Pengandingan Sisi Kiri Sisi Kanan Terperinci EP2AGZ300FH29C3G disebabkan oleh Intel dan EP2AGZ300FH29I4G disebabkan oleh Intel. Bandingkan spesifikasi utama, parameter elektrik, pakej, status kehidupan, harga, dan keupayaan untuk menentukan komponen terbaik untuk keperluan disenjaya anda.
Pengandingan Spesifikasi
| Parametr | EP2AGZ300FH29C3G | EP2AGZ300FH29I4G |
|---|---|---|
| Merek | Intel | Intel |
| Kategori | FPGA & CPLD | FPGA & CPLD |
| Status Lingkungan Hidup | Aktif | Aktif |
| Series | Arria II GZ | — |
| Manufacturer | Intel (Altera) | — |
| Logic Elements | 300,000 | — |
| Number of I/O | 281 | 281 |
| Kemasan | 780-BGA (HBGA, 29 mm) | — |
| Jenis Pemasangan | Surface Mount | Surface Mount (BGA) |
| Suhu Operasi | 0C to +85C (commercial, speed grade 3) | — |
| Speed Grade | 3 | I4 |
| Supply Voltage (Core) | [DATA_NEEDED: core voltage] | 0.9 V (typical) |
| Process Node | 40 nm | 40 nm TSMC |
| Embedded Memory | M9K / M144K block RAM | — |
| DSP Blocks | Yes (variable-precision DSP) | Yes (variable-precision, per family) |
| Transceivers | Yes (multi-gigabit) | Embedded multi-gigabit transceivers (per family) |
| Status RoHS | Compliant | Compliant |
| Aras MSL | 3 (per JEDEC J-STD-020, where stated) | [DATA_NEEDED: MSL rating] |
| Family | — | Arria II GZ (AGZ) |
| Logic Elements (LE) | — | 300,000 (approx., per family member) |
| Package Type | — | 780-ball Flip-Chip BGA (FineLine) |
| Package Code | — | FH29 (29x29 mm) |
| Gambaran Suhu Operasi | — | -40C to +100C (industrial, I-grade) |
| Configuration Method | — | JTAG / Passive Serial / Fast Passive Parallel |
| Block RAM | — | Embedded M9K / M144K blocks |
| Lead-Free | — | Yes (per RoHS) |