EP2AGZ300FH29C3G vs EP2AGZ300FH29I4G Perbandingan
Perbandingan bersamaan detil EP2AGZ300FH29C3G dari Intel dan EP2AGZ300FH29I4G dari Intel. Bandingkan spesifikasi penting, parameter listrik, pengemasan, status cycle, harga, dan ketersediaan untuk menentukan komponen terbaik untuk kebutuhan desain Anda.
Perbandingan Spesifikasi
| Parameter Umum | EP2AGZ300FH29C3G | EP2AGZ300FH29I4G |
|---|---|---|
| Merek | Intel | Intel |
| Kategori | FPGA & CPLD | FPGA & CPLD |
| Status Lingkungan Hidup | Aktif | Aktif |
| Series | Arria II GZ | — |
| Manufacturer | Intel (Altera) | — |
| Logic Elements | 300,000 | — |
| Number of I/O | 281 | 281 |
| Paket | 780-BGA (HBGA, 29 mm) | — |
| Tipe Mounting | Surface Mount | Surface Mount (BGA) |
| Suhu Kerja | 0C to +85C (commercial, speed grade 3) | — |
| Speed Grade | 3 | I4 |
| Supply Voltage (Core) | [DATA_NEEDED: core voltage] | 0.9 V (typical) |
| Process Node | 40 nm | 40 nm TSMC |
| Embedded Memory | M9K / M144K block RAM | — |
| DSP Blocks | Yes (variable-precision DSP) | Yes (variable-precision, per family) |
| Transceivers | Yes (multi-gigabit) | Embedded multi-gigabit transceivers (per family) |
| Status RoHS | Compliant | Compliant |
| Level MSL | 3 (per JEDEC J-STD-020, where stated) | [DATA_NEEDED: MSL rating] |
| Family | — | Arria II GZ (AGZ) |
| Logic Elements (LE) | — | 300,000 (approx., per family member) |
| Package Type | — | 780-ball Flip-Chip BGA (FineLine) |
| Package Code | — | FH29 (29x29 mm) |
| Rentang Suhu Kerja | — | -40C to +100C (industrial, I-grade) |
| Configuration Method | — | JTAG / Passive Serial / Fast Passive Parallel |
| Block RAM | — | Embedded M9K / M144K blocks |
| Lead-Free | — | Yes (per RoHS) |