EP2C8F256I8N vs EP2C8F256CXNAA Perbandingan
Perbandingan bersamaan detil EP2C8F256I8N dari Intel dan EP2C8F256CXNAA dari Intel. Bandingkan spesifikasi penting, parameter listrik, pengemasan, status cycle, harga, dan ketersediaan untuk menentukan komponen terbaik untuk kebutuhan desain Anda.
Perbandingan Spesifikasi
| Parameter Umum | EP2C8F256I8N | EP2C8F256CXNAA |
|---|---|---|
| Merek | Intel | Intel |
| Kategori | FPGA & CPLD | FPGA & CPLD |
| Status Lingkungan Hidup | NRND | NRND |
| Series | Cyclone II | — |
| Logic Elements (LEs) | 8,256 | — |
| Embedded Memory Bits | 165,888 bits | — |
| Total RAM Bits | 165,888 | — |
| Logic Blocks / Logic Cells | 540 (Logic Cells) | — |
| User I/O Pins | 182 | — |
| Number of LABs/CLBs | [DATA_NEEDED: LAB count] | — |
| Embedded 18x18 Multipliers | Up to 36 | 18 |
| PLLs | 2 | 4 |
| Global Clock Networks | 16 | — |
| Core Supply Voltage | 1.2 V | 1.15 V to 1.25 V |
| I/O Supply Voltage | 1.5 V / 1.8 V / 2.5 V / 3.3 V (bank-dependent) | — |
| Process Technology | 90 nm CMOS (SRAM-based) | 90 nm |
| Package Type | 256-LBGA (FineLine BGA), 17x17 mm, 1.0 mm pitch | — |
| Suhu Kerja | -40C to +85C (industrial) | — |
| Configuration Method | SRAM, loaded from external EPCS flash at power-up | — |
| Status RoHS | Compliant (Pb-free, lead-free reflow compatible) | — |
| Tipe Mounting | Surface Mount (BGA) | Surface Mount (BGA) |
| Family | — | Cyclone II |
| Logic Elements | — | 8,256 |
| Embedded Memory (M4K blocks) | — | 36 blocks (162 Kbits total) |
| Maximum User I/O Pins | — | 182 |
| User Flash Memory | — | 0 Kbits |
| I/O Standards | — | LVCMOS, LVTTL (3.3V, 2.5V, 1.8V, 1.5V) |
| Paket | — | 256-ball FineLine BGA (F256), 1.0 mm pitch, 17x17 mm |
| Configuration Modes | — | Active Serial (AS), Passive Serial (PS), JTAG |
| Operating Temperature (Industrial) | — | -40C to +85C (N suffix) |
| RoHS Compliance | — | Yes (lead-free) |
| Level MSL | — | 3 |