EP2C8F256I8N vs EP2C8F256CXNAA Pengandingan
Pengandingan Sisi Kiri Sisi Kanan Terperinci EP2C8F256I8N disebabkan oleh Intel dan EP2C8F256CXNAA disebabkan oleh Intel. Bandingkan spesifikasi utama, parameter elektrik, pakej, status kehidupan, harga, dan keupayaan untuk menentukan komponen terbaik untuk keperluan disenjaya anda.
Pengandingan Spesifikasi
| Parametr | EP2C8F256I8N | EP2C8F256CXNAA |
|---|---|---|
| Merek | Intel | Intel |
| Kategori | FPGA & CPLD | FPGA & CPLD |
| Status Lingkungan Hidup | NRND | NRND |
| Series | Cyclone II | — |
| Logic Elements (LEs) | 8,256 | — |
| Embedded Memory Bits | 165,888 bits | — |
| Total RAM Bits | 165,888 | — |
| Logic Blocks / Logic Cells | 540 (Logic Cells) | — |
| User I/O Pins | 182 | — |
| Number of LABs/CLBs | [DATA_NEEDED: LAB count] | — |
| Embedded 18x18 Multipliers | Up to 36 | 18 |
| PLLs | 2 | 4 |
| Global Clock Networks | 16 | — |
| Core Supply Voltage | 1.2 V | 1.15 V to 1.25 V |
| I/O Supply Voltage | 1.5 V / 1.8 V / 2.5 V / 3.3 V (bank-dependent) | — |
| Process Technology | 90 nm CMOS (SRAM-based) | 90 nm |
| Package Type | 256-LBGA (FineLine BGA), 17x17 mm, 1.0 mm pitch | — |
| Suhu Operasi | -40C to +85C (industrial) | — |
| Configuration Method | SRAM, loaded from external EPCS flash at power-up | — |
| Status RoHS | Compliant (Pb-free, lead-free reflow compatible) | — |
| Jenis Pemasangan | Surface Mount (BGA) | Surface Mount (BGA) |
| Family | — | Cyclone II |
| Logic Elements | — | 8,256 |
| Embedded Memory (M4K blocks) | — | 36 blocks (162 Kbits total) |
| Maximum User I/O Pins | — | 182 |
| User Flash Memory | — | 0 Kbits |
| I/O Standards | — | LVCMOS, LVTTL (3.3V, 2.5V, 1.8V, 1.5V) |
| Kemasan | — | 256-ball FineLine BGA (F256), 1.0 mm pitch, 17x17 mm |
| Configuration Modes | — | Active Serial (AS), Passive Serial (PS), JTAG |
| Operating Temperature (Industrial) | — | -40C to +85C (N suffix) |
| RoHS Compliance | — | Yes (lead-free) |
| Aras MSL | — | 3 |