EP2SGX30CF780I4N vs EP2SGX30DF780I3N Comparison
Detailed side-by-side comparison of EP2SGX30CF780I4N by Intel and EP2SGX30DF780I3N by Intel. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.
Intel
EP2SGX30CF780I4N
EP2SGX30CF780I4N - 33.88K LE Stratix II GX FPGA, 780-FBGA | Intel
EP2SGX30CF780I4N NrndIntel
EP2SGX30DF780I3N
EP2SGX30DF780I3N - Stratix II GX FPGA, 33.8K LE, 780-FBGA | Intel
EP2SGX30DF780I3N NrndSpecification Comparison
| Parameter | EP2SGX30CF780I4N | EP2SGX30DF780I3N |
|---|---|---|
| Brand | Intel | Intel |
| Category | FPGA & CPLD | FPGA & CPLD |
| Lifecycle Status | Nrnd | Nrnd |
| Stock Status | In Stock | In Stock |
| Unit Price (USD) | $138.00 | $171.00 |
| Family | Stratix II GX | Stratix II GX |
| Logic Elements | 33,880 | 33,880 |
| Logic Cells / CLBs | 33,880 | β |
| Process Technology | 90 nm CMOS | 90 nm CMOS |
| Core Supply Voltage | 1.15 V to 1.25 V | 1.2 V |
| Maximum Internal Frequency | 622.08 MHz | β |
| Embedded Transceivers | 4 channels (up to 3.125 Gbps at C4) | β |
| Package | 780-ball FC-FBGA, 29 x 29 mm, 1.0 mm pitch | 780-ball FBGA (Fine-Pitch BGA), 29 x 29 mm, 1 mm pitch |
| Pin / Terminal Count | 780 | β |
| Operating Temperature | -40C to +85C (Industrial) | β |
| Mounting Type | Surface Mount (BGA) | Surface Mount |
| Lead-Free | Yes | β |
| RoHS Status | [DATA_NEEDED: RoHS compliance status] | Compliant |
| Memory Type | Embedded SRAM, external DDR/DDR2/QDR support | β |
| Configuration | JTAG / passive serial / fast passive parallel | β |
| Logic Cells | β | 33,380 |
| Configurable Logic Blocks (CLBs) | β | 33,880 |
| Total Memory Bits | β | 1,369,728 |
| Maximum Core Frequency | β | 622.08 MHz |
| User I/O Pins | β | 361 |
| Operating Temperature Grade | β | Industrial |
| Lead Free | β | Yes |
| Speed Grade | β | I3 |