EP2SGX30CF780I4N vs EP2SGX30DF780I3N Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng EP2SGX30CF780I4N sa pamamagitan ng Intel at EP2SGX30DF780I3N sa pamamagitan ng Intel. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
Pagsanggunian na paghahambing
| Parametro | EP2SGX30CF780I4N | EP2SGX30DF780I3N |
|---|---|---|
| Brand | Intel | Intel |
| Kategorya | FPGA & CPLD | FPGA & CPLD |
| Katayuan ng Lifecycle | NRND | NRND |
| Family | Stratix II GX | Stratix II GX |
| Logic Elements | 33,880 | 33,880 |
| Logic Cells / CLBs | 33,880 | — |
| Process Technology | 90 nm CMOS | 90 nm CMOS |
| Core Supply Voltage | 1.15 V to 1.25 V | 1.2 V |
| Maximum Internal Frequency | 622.08 MHz | — |
| Embedded Transceivers | 4 channels (up to 3.125 Gbps at C4) | — |
| Packhaging | 780-ball FC-FBGA, 29 x 29 mm, 1.0 mm pitch | 780-ball FBGA (Fine-Pitch BGA), 29 x 29 mm, 1 mm pitch |
| Pin / Terminal Count | 780 | — |
| Temperature na Operasyon | -40C to +85C (Industrial) | — |
| Uri ng Pagpapasok | Surface Mount (BGA) | Surface Mount |
| Lead-Free | Yes | — |
| Tindminan RoHS | [DATA_NEEDED: RoHS compliance status] | Compliant |
| Uri ng Memory | Embedded SRAM, external DDR/DDR2/QDR support | — |
| Configuration | JTAG / passive serial / fast passive parallel | — |
| Logic Cells | — | 33,380 |
| Configurable Logic Blocks (CLBs) | — | 33,880 |
| Total Memory Bits | — | 1,369,728 |
| Maximum Core Frequency | — | 622.08 MHz |
| User I/O Pins | — | 361 |
| Operating Temperature Grade | — | Industrial |
| Lead Free | — | Yes |
| Speed Grade | — | I3 |