EP2SGX90EF1152C5N vs EP2SGX90EF1152I3 Pengandingan

Pengandingan Sisi Kiri Sisi Kanan Terperinci EP2SGX90EF1152C5N disebabkan oleh Intel dan EP2SGX90EF1152I3 disebabkan oleh Intel. Bandingkan spesifikasi utama, parameter elektrik, pakej, status kehidupan, harga, dan keupayaan untuk menentukan komponen terbaik untuk keperluan disenjaya anda.

Intel
EP2SGX90EF1152I3 EP2SGX90EF1152I3 - 90,960 LEs, Stratix II GX FPGA | Intel

EP2SGX90EF1152I3 - 90,960 LEs, Stratix II GX FPGA | Intel

EP2SGX90EF1152I3 ⚠ Bahagian terakhir untuk beli

Pengandingan Spesifikasi

Parametr EP2SGX90EF1152C5N EP2SGX90EF1152I3
Merek Intel Intel
Kategori FPGA & CPLD FPGA & CPLD
Status Lingkungan Hidup NRND Masa Terakhir Dibeli
Series Stratix II GX Stratix II GX
Family FPGA - Field Programmable Gate Array —
Logic Elements 90,960 90,960
Logic Array Blocks (LABs) 4,548 —
Total RAM Bits 4,520,448 4,520,448
User I/Os 558 —
Number of I/O Banks [DATA_NEEDED: number of I/O banks] —
Core Voltage 1.2 V —
Process Technology 90 nm 90 nm CMOS
Kemasan 1152-ball FC-FBGA —
Jenis Pemasangan Surface Mount Surface Mount
Speed Grade 5 —
Suhu Operasi 0C to +85C (Commercial) —
Status RoHS Compliant Compliant
Aras MSL [DATA_NEEDED: MSL level] —
Transceivers Up to 12 multi-gigabit transceivers —
Transceiver Data Rate Up to 6.375 Gbps —
Adaptive Logic Modules (ALMs) — 558
Equivalent Logic Cells (CLBs) — 90,960
Maximum Operating Frequency — 622.08 MHz
Core Supply Voltage (VCCINT) — 1.2 V nominal (1.15 V to 1.25 V)
Operating Temperature Grade — Industrial (-40C to +100C)
Package Type — 1152-ball FC-FBGA (flip-chip)
Terminal Form — Ball
Terminal Pitch — [DATA_NEEDED: ball pitch]
Package Code — BGA
Package Shape — Square
Configuration Architecture — Enhanced Configuration (EPC) devices supported

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