EP3C10E144C7N vs EP3C10F256C6 Perbandingan
Perbandingan bersamaan detil EP3C10E144C7N dari Intel dan EP3C10F256C6 dari Intel. Bandingkan spesifikasi penting, parameter listrik, pengemasan, status cycle, harga, dan ketersediaan untuk menentukan komponen terbaik untuk kebutuhan desain Anda.
Perbandingan Spesifikasi
| Parameter Umum | EP3C10E144C7N | EP3C10F256C6 |
|---|---|---|
| Merek | Intel | Intel |
| Kategori | FPGA & CPLD | FPGA & CPLD |
| Status Lingkungan Hidup | Aktif | Aktif |
| Family | Cyclone® III | Cyclone III |
| Manufacturer | Intel (formerly Altera) | — |
| Logic Elements (LEs) | 10,320 | — |
| Embedded Memory (M9K BRAM) | 414 Kbits | — |
| Embedded 18x18 Multipliers | 23 | 23 |
| Maximum User I/Os | 94 | 182 |
| PLLs | 4 | 2 |
| Core Voltage (VCCINT) | 1.15 V to 1.25 V | 1.15 V to 1.25 V (typ. 1.2 V) |
| Maximum Internal Clock Frequency | 437.5 MHz | — |
| Paket | 144-pin LQFP Exposed Pad (EQFP-144) | 256-FBGA (FineLine BGA, 17x17 mm, 1.0 mm pitch) |
| Process Technology | TSMC 65 nm low-power CMOS | 60 nm low-power CMOS |
| Configuration Modes | JTAG, Active Serial, Active Parallel | — |
| Suhu Hubung Kerja | 0C to +85C (Commercial, C7 speed grade) | — |
| I/O Standards Supported | LVDS, LVCMOS, SSTL, HSTL (per bank VCCIO) | — |
| Status RoHS | Compliant | Compliant (lead-free FBGA) |
| Logic Elements (LE) | — | 10,320 |
| Total Memory Bits | — | 423,936 bits |
| Tipe Mounting | — | Surface Mount (BGA) |
| I/O Voltage (VCCIO) | — | 1.2 V to 3.3 V (bank-dependent) |
| Configuration Memory | — | SRAM-based (external EPCS flash required) |
| Suhu Kerja | — | -40 C to +125 C (industrial, suffix 'C') |
| Speed Grade | — | 6 |
| Level MSL | — | 3 (168 hours) |