EP3C16F256I7N vs EP3C16F256C8 Comparison
Detailed side-by-side comparison of EP3C16F256I7N by Intel and EP3C16F256C8 by Intel. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.
Specification Comparison
| Parameter | EP3C16F256I7N | EP3C16F256C8 |
|---|---|---|
| Brand | Intel | Intel |
| Category | FPGA & CPLD | FPGA & CPLD |
| Lifecycle Status | Active | Obsolete |
| Family | Cyclone III | — |
| Logic Elements (LEs) | 15408 | — |
| Logic Array Blocks (LABs) | 963 | — |
| Total Memory Bits | 516096 | — |
| Embedded Memory | 56 M9K blocks (504 Kbit) | 516,096 bits (504 Kb) |
| Embedded 18x18 Multipliers | 56 | — |
| PLLs | 4 | — |
| Maximum User I/O Pins | 168 | — |
| Package | 256-ball FBGA (17 mm x 17 mm, 1.0 mm pitch) | 256-LBGA (F256) |
| Operating Temperature | -40C to +100C (industrial, I7) | — |
| Supply Voltage (Core) | 1.2 V typical | — |
| Process Technology | TSMC 60 nm low-leakage | 65 nm CMOS |
| Configuration | SRAM-based, requires external config device (EPCS/EPCQ) | — |
| Lead-Free / Pb-Free | Yes (N suffix per JEDEC JESD97) | — |
| RoHS Compliance | Compliant | [DATA_NEEDED: RoHS compliance] |
| Device Type | — | Cyclone III Field-Programmable Gate Array (FPGA) |
| Logic Elements | — | 15,408 logic elements |
| Maximum Frequency | — | 402 MHz |
| I/O Pins | — | 168 pins |
| Core Supply Voltage | — | 1.2 V |
| Package Dimensions | — | 17 mm × 17 mm |
| Number of Package Terminals | — | 256 balls |
| Mounting Style | — | Surface mount |
| Speed Grade | — | Grade 8 |
| Commercial Junction Temperature | — | 0 °C to 85 °C |
| Industrial Junction Temperature | — | -40 °C to 125 °C |
| Package Outline Reference | — | MS-034 |
| Lead-Free Status | — | Lead free |
| Terminal Form | — | Ball-grid array |
| Programmable Logic Family | — | Cyclone III |
| REACH Compliance | — | [DATA_NEEDED: REACH compliance] |
| AEC-Q100 Qualification | — | [DATA_NEEDED: AEC-Q100 qualification] |