EP3C16F256I7N vs EP3C16F256C8 Pengandingan

Pengandingan Sisi Kiri Sisi Kanan Terperinci EP3C16F256I7N disebabkan oleh Intel dan EP3C16F256C8 disebabkan oleh Intel. Bandingkan spesifikasi utama, parameter elektrik, pakej, status kehidupan, harga, dan keupayaan untuk menentukan komponen terbaik untuk keperluan disenjaya anda.

Pengandingan Spesifikasi

Parametr EP3C16F256I7N EP3C16F256C8
Merek Intel Intel
Kategori FPGA & CPLD FPGA & CPLD
Status Lingkungan Hidup Aktif Obsolete
Family Cyclone III —
Logic Elements (LEs) 15408 —
Logic Array Blocks (LABs) 963 —
Total Memory Bits 516096 —
Embedded Memory 56 M9K blocks (504 Kbit) 516,096 bits (504 Kb)
Embedded 18x18 Multipliers 56 —
PLLs 4 —
Maximum User I/O Pins 168 —
Kemasan 256-ball FBGA (17 mm x 17 mm, 1.0 mm pitch) 256-LBGA (F256)
Suhu Operasi -40C to +100C (industrial, I7) —
Supply Voltage (Core) 1.2 V typical —
Process Technology TSMC 60 nm low-leakage 65 nm CMOS
Configuration SRAM-based, requires external config device (EPCS/EPCQ) —
Lead-Free / Pb-Free Yes (N suffix per JEDEC JESD97) —
RoHS Compliance Compliant [DATA_NEEDED: RoHS compliance]
Device Type — Cyclone III Field-Programmable Gate Array (FPGA)
Logic Elements — 15,408 logic elements
Maximum Frequency — 402 MHz
I/O Pins — 168 pins
Core Supply Voltage — 1.2 V
Package Dimensions — 17 mm × 17 mm
Number of Package Terminals — 256 balls
Gaya Pemasangan — Surface mount
Speed Grade — Grade 8
Commercial Junction Temperature — 0 °C to 85 °C
Industrial Junction Temperature — -40 °C to 125 °C
Package Outline Reference — MS-034
Lead-Free Status — Lead free
Terminal Form — Ball-grid array
Programmable Logic Family — Cyclone III
REACH Compliance — [DATA_NEEDED: REACH compliance]
AEC-Q100 Qualification — [DATA_NEEDED: AEC-Q100 qualification]

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