EP3C16F256I7N vs EP3C16F256C8 Vergleich

Detaillierter Direktvergleich von EP3C16F256I7N von Intel und EP3C16F256C8 von Intel. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.

Spezifikationsvergleich

Parameter EP3C16F256I7N EP3C16F256C8
Marke Intel Intel
Kategorie FPGA & CPLD FPGA & CPLD
Lebenszyklusstatus Aktiv Obsolete
Family Cyclone III —
Logic Elements (LEs) 15408 —
Logic Array Blocks (LABs) 963 —
Total Memory Bits 516096 —
Embedded Memory 56 M9K blocks (504 Kbit) 516,096 bits (504 Kb)
Embedded 18x18 Multipliers 56 —
PLLs 4 —
Maximum User I/O Pins 168 —
Gehäuse 256-ball FBGA (17 mm x 17 mm, 1.0 mm pitch) 256-LBGA (F256)
Betriebstemperatur -40C to +100C (industrial, I7) —
Supply Voltage (Core) 1.2 V typical —
Process Technology TSMC 60 nm low-leakage 65 nm CMOS
Configuration SRAM-based, requires external config device (EPCS/EPCQ) —
Lead-Free / Pb-Free Yes (N suffix per JEDEC JESD97) —
RoHS Compliance Compliant [DATA_NEEDED: RoHS compliance]
Device Type — Cyclone III Field-Programmable Gate Array (FPGA)
Logic Elements — 15,408 logic elements
Maximum Frequency — 402 MHz
I/O Pins — 168 pins
Core Supply Voltage — 1.2 V
Package Dimensions — 17 mm × 17 mm
Number of Package Terminals — 256 balls
Montagestil — Surface mount
Speed Grade — Grade 8
Commercial Junction Temperature — 0 °C to 85 °C
Industrial Junction Temperature — -40 °C to 125 °C
Package Outline Reference — MS-034
Lead-Free Status — Lead free
Terminal Form — Ball-grid array
Programmable Logic Family — Cyclone III
REACH Compliance — [DATA_NEEDED: REACH compliance]
AEC-Q100 Qualification — [DATA_NEEDED: AEC-Q100 qualification]

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