EP3C16F256I7N vs EP3C16F256C8 Perbandingan
Perbandingan bersamaan detil EP3C16F256I7N dari Intel dan EP3C16F256C8 dari Intel. Bandingkan spesifikasi penting, parameter listrik, pengemasan, status cycle, harga, dan ketersediaan untuk menentukan komponen terbaik untuk kebutuhan desain Anda.
Perbandingan Spesifikasi
| Parameter Umum | EP3C16F256I7N | EP3C16F256C8 |
|---|---|---|
| Merek | Intel | Intel |
| Kategori | FPGA & CPLD | FPGA & CPLD |
| Status Lingkungan Hidup | Aktif | Obsolete |
| Family | Cyclone III | — |
| Logic Elements (LEs) | 15408 | — |
| Logic Array Blocks (LABs) | 963 | — |
| Total Memory Bits | 516096 | — |
| Embedded Memory | 56 M9K blocks (504 Kbit) | 516,096 bits (504 Kb) |
| Embedded 18x18 Multipliers | 56 | — |
| PLLs | 4 | — |
| Maximum User I/O Pins | 168 | — |
| Paket | 256-ball FBGA (17 mm x 17 mm, 1.0 mm pitch) | 256-LBGA (F256) |
| Suhu Kerja | -40C to +100C (industrial, I7) | — |
| Supply Voltage (Core) | 1.2 V typical | — |
| Process Technology | TSMC 60 nm low-leakage | 65 nm CMOS |
| Configuration | SRAM-based, requires external config device (EPCS/EPCQ) | — |
| Lead-Free / Pb-Free | Yes (N suffix per JEDEC JESD97) | — |
| RoHS Compliance | Compliant | [DATA_NEEDED: RoHS compliance] |
| Device Type | — | Cyclone III Field-Programmable Gate Array (FPGA) |
| Logic Elements | — | 15,408 logic elements |
| Maximum Frequency | — | 402 MHz |
| I/O Pins | — | 168 pins |
| Core Supply Voltage | — | 1.2 V |
| Package Dimensions | — | 17 mm × 17 mm |
| Number of Package Terminals | — | 256 balls |
| Gaya Mounting | — | Surface mount |
| Speed Grade | — | Grade 8 |
| Commercial Junction Temperature | — | 0 °C to 85 °C |
| Industrial Junction Temperature | — | -40 °C to 125 °C |
| Package Outline Reference | — | MS-034 |
| Lead-Free Status | — | Lead free |
| Terminal Form | — | Ball-grid array |
| Programmable Logic Family | — | Cyclone III |
| REACH Compliance | — | [DATA_NEEDED: REACH compliance] |
| AEC-Q100 Qualification | — | [DATA_NEEDED: AEC-Q100 qualification] |