EP3C16F256I7N vs EP3C16F256C8 مقارنة
مقارنة تفصيلية جنبًا إلى جنب لـ EP3C16F256I7N بواسطة Intel و EP3C16F256C8 بواسطة Intel. قارن المواصفات الرئيسية والمعلمات الكهربائية والتغليف وحالة دورة الحياة والأسعار والتوافر لتحديد أفضل مكوّن لمتطلبات تصميمك.
مقارنة المواصفات
| المعامل | EP3C16F256I7N | EP3C16F256C8 |
|---|---|---|
| العلامة التجارية | Intel | Intel |
| الفئة | FPGA & CPLD | FPGA & CPLD |
| حالة دورة الحياة | نشط | Obsolete |
| Family | Cyclone III | — |
| Logic Elements (LEs) | 15408 | — |
| Logic Array Blocks (LABs) | 963 | — |
| Total Memory Bits | 516096 | — |
| Embedded Memory | 56 M9K blocks (504 Kbit) | 516,096 bits (504 Kb) |
| Embedded 18x18 Multipliers | 56 | — |
| PLLs | 4 | — |
| Maximum User I/O Pins | 168 | — |
| العلبة | 256-ball FBGA (17 mm x 17 mm, 1.0 mm pitch) | 256-LBGA (F256) |
| درجة حرارة التشغيل | -40C to +100C (industrial, I7) | — |
| Supply Voltage (Core) | 1.2 V typical | — |
| Process Technology | TSMC 60 nm low-leakage | 65 nm CMOS |
| Configuration | SRAM-based, requires external config device (EPCS/EPCQ) | — |
| Lead-Free / Pb-Free | Yes (N suffix per JEDEC JESD97) | — |
| RoHS Compliance | Compliant | [DATA_NEEDED: RoHS compliance] |
| Device Type | — | Cyclone III Field-Programmable Gate Array (FPGA) |
| Logic Elements | — | 15,408 logic elements |
| Maximum Frequency | — | 402 MHz |
| I/O Pins | — | 168 pins |
| Core Supply Voltage | — | 1.2 V |
| Package Dimensions | — | 17 mm × 17 mm |
| Number of Package Terminals | — | 256 balls |
| نمط التركيب | — | Surface mount |
| Speed Grade | — | Grade 8 |
| Commercial Junction Temperature | — | 0 °C to 85 °C |
| Industrial Junction Temperature | — | -40 °C to 125 °C |
| Package Outline Reference | — | MS-034 |
| Lead-Free Status | — | Lead free |
| Terminal Form | — | Ball-grid array |
| Programmable Logic Family | — | Cyclone III |
| REACH Compliance | — | [DATA_NEEDED: REACH compliance] |
| AEC-Q100 Qualification | — | [DATA_NEEDED: AEC-Q100 qualification] |