EP3C16F256I7N vs EP3C25F256I7N Perbandingan
Perbandingan bersamaan detil EP3C16F256I7N dari Intel dan EP3C25F256I7N dari Intel. Bandingkan spesifikasi penting, parameter listrik, pengemasan, status cycle, harga, dan ketersediaan untuk menentukan komponen terbaik untuk kebutuhan desain Anda.
Perbandingan Spesifikasi
| Parameter Umum | EP3C16F256I7N | EP3C25F256I7N |
|---|---|---|
| Merek | Intel | Intel |
| Kategori | FPGA & CPLD | FPGA & CPLD |
| Status Lingkungan Hidup | Aktif | Aktif |
| Family | Cyclone III | Cyclone III |
| Logic Elements (LEs) | 15408 | — |
| Logic Array Blocks (LABs) | 963 | — |
| Total Memory Bits | 516096 | — |
| Embedded Memory | 56 M9K blocks (504 Kbit) | 608,256 bits |
| Embedded 18x18 Multipliers | 56 | — |
| PLLs | 4 | 4 general-purpose PLLs |
| Maximum User I/O Pins | 168 | — |
| Paket | 256-ball FBGA (17 mm x 17 mm, 1.0 mm pitch) | 256-FBGA (FineLine BGA) |
| Suhu Kerja | -40C to +100C (industrial, I7) | -40C to +125C |
| Supply Voltage (Core) | 1.2 V typical | — |
| Process Technology | TSMC 60 nm low-leakage | 65 nm low-power |
| Configuration | SRAM-based, requires external config device (EPCS/EPCQ) | SRAM-based, in-system programmable |
| Lead-Free / Pb-Free | Yes (N suffix per JEDEC JESD97) | — |
| RoHS Compliance | Compliant | — |
| Device Type | — | FPGA |
| Logic Elements | — | 24,624 |
| Embedded Multipliers | — | 66 (18x18) |
| Maximum User I/O | — | 156 |
| Core Supply Voltage | — | 1.2 V |
| Speed Grade | — | 7 |
| External Memory Support | — | DDR/DDR2/QDRII/QDRII+ |
| Tipe Mounting | — | Surface Mount |
| Status RoHS | — | Compliant (lead-free) |
| Hot Socketing | — | Supported |