EP3C25F324C6N vs EP3C25F324I7N Comparison
Detailed side-by-side comparison of EP3C25F324C6N by Intel and EP3C25F324I7N by Intel. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.
Specification Comparison
| Parameter | EP3C25F324C6N | EP3C25F324I7N |
|---|---|---|
| Brand | Intel | Intel |
| Category | FPGA & CPLD | FPGA & CPLD |
| Lifecycle Status | Active | Active |
| Stock Status | In Stock | In Stock |
| Unit Price (USD) | $62.30 | $58.20 |
| Series | Cyclone III | β |
| Family | Cyclone III (low-power, low-cost FPGA) | Cyclone III |
| Logic Elements (LE) | 24,624 | β |
| Total Memory Bits | 608,256 bits | β |
| Embedded Memory Blocks | M9K blocks, 66 total | β |
| Embedded Multipliers | 66 (18x18) | β |
| DSP Blocks | 66 dedicated 18x18 multipliers | β |
| User I/O Pins | 215 | β |
| Number of I/O Banks | 8 | β |
| PLLs | 4 general-purpose PLLs | 4 |
| Package | 324-BGA (FBGA-324), fine-pitch | 324-ball FBGA (Fine-Pitch BGA) |
| Speed Grade | C6 (commercial) | 7 (slower speed grade, lower power) |
| Operating Temperature | 0C to +85C (commercial) | -40C to +100C (Industrial) |
| Process Technology | TSMC 65 nm low-power (LP) | 65 nm |
| Configuration Schemes | Passive Serial, Fast Passive Parallel, JTAG | β |
| Lead-Free / RoHS | Yes (lead-free, RoHS compliant) | β |
| Mounting Type | Surface Mount | β |
| Logic Elements (LEs) | β | 24,624 |
| Embedded Memory | β | 608,256 bits (66 M9K blocks of 9 Kbits each) |
| Embedded 18x18 Multipliers | β | 66 |
| Maximum User I/O Pins | β | 215 |
| LVDS Pairs | β | 66 |
| Global Clock Networks | β | 20 |
| Core Voltage | β | 1.2 V |
| I/O Bank Voltage Range | β | 1.2 V to 3.3 V (LVCMOS, LVTTL, LVDS, SSTL, HSTL) |
| Configuration Modes | β | Active Serial (AS), Passive Serial (PS), JTAG, Fast Passive Parallel (FPP) |
| RoHS Status | β | Compliant |
| Lead-Free | β | Yes |
| MSL Level | β | 3 (168 hours) |