EP3C25F324C6N vs EP3C25F324I7N 비교
다음의 상세 나란히 비교: EP3C25F324C6N 제조: Intel 및 EP3C25F324I7N 제조: Intel. 주요 사양, 전기적 파라미터, 패키징, 수명 주기 상태, 가격 및 재고를 비교하여 설계 요구 사항에 가장 적합한 부품을 결정하십시오.
사양 비교
| 파라미터 | EP3C25F324C6N | EP3C25F324I7N |
|---|---|---|
| 브랜드 | Intel | Intel |
| 카테고리 | FPGA & CPLD | FPGA & CPLD |
| 수명 주기 상태 | 활성 | 활성 |
| 재고 상태 | In Stock | In Stock |
| 단가 (USD) | $62.30 | $58.20 |
| Series | Cyclone III | — |
| Family | Cyclone III (low-power, low-cost FPGA) | Cyclone III |
| Logic Elements (LE) | 24,624 | — |
| Total Memory Bits | 608,256 bits | — |
| Embedded Memory Blocks | M9K blocks, 66 total | — |
| Embedded Multipliers | 66 (18x18) | — |
| DSP Blocks | 66 dedicated 18x18 multipliers | — |
| User I/O Pins | 215 | — |
| Number of I/O Banks | 8 | — |
| PLLs | 4 general-purpose PLLs | 4 |
| 패키지 | 324-BGA (FBGA-324), fine-pitch | 324-ball FBGA (Fine-Pitch BGA) |
| Speed Grade | C6 (commercial) | 7 (slower speed grade, lower power) |
| 동작 온도 | 0C to +85C (commercial) | -40C to +100C (Industrial) |
| Process Technology | TSMC 65 nm low-power (LP) | 65 nm |
| Configuration Schemes | Passive Serial, Fast Passive Parallel, JTAG | — |
| Lead-Free / RoHS | Yes (lead-free, RoHS compliant) | — |
| 실장 유형 | Surface Mount | — |
| Logic Elements (LEs) | — | 24,624 |
| Embedded Memory | — | 608,256 bits (66 M9K blocks of 9 Kbits each) |
| Embedded 18x18 Multipliers | — | 66 |
| Maximum User I/O Pins | — | 215 |
| LVDS Pairs | — | 66 |
| Global Clock Networks | — | 20 |
| Core Voltage | — | 1.2 V |
| I/O Bank Voltage Range | — | 1.2 V to 3.3 V (LVCMOS, LVTTL, LVDS, SSTL, HSTL) |
| Configuration Modes | — | Active Serial (AS), Passive Serial (PS), JTAG, Fast Passive Parallel (FPP) |
| RoHS 상태 | — | Compliant |
| Lead-Free | — | Yes |
| MSL 레벨 | — | 3 (168 hours) |