EP3C25F324C7N vs EP3C25F324C7 Comparison

Detailed side-by-side comparison of EP3C25F324C7N by Intel and EP3C25F324C7 by Intel. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.

Specification Comparison

Parameter EP3C25F324C7N EP3C25F324C7
Brand Intel Intel
Category FPGA & CPLD FPGA & CPLD
Lifecycle Status Active Active
Product Type Field Programmable Gate Array (FPGA) —
Device Family Cyclone III —
Logic Cells 24,624 cells —
Embedded Memory 608,256 bits —
Available I/O Pins 215 I/O —
Maximum Listed Frequency 437.5 MHz —
Process Technology 65 nm —
Core Voltage 1.2 V —
Package 324-ball FBGA —
Terminal Count 324 terminals —
Terminal Form Ball Ball
Package Code BGA BGA
Package Shape Rectangular Square
Mounting Type Surface Mount Surface Mount
Temperature Grading Other —
Programmability Field programmable —
RoHS Status [DATA_NEEDED: RoHS status] —
REACH Status [DATA_NEEDED: REACH status] —
AEC-Q100 Qualification [DATA_NEEDED: AEC-Q100 qualification] —
Device Type — Field Programmable Gate Array (FPGA)
FPGA Family — Cyclone III
Logic Elements — 24,624
Memory Bits — 608,256 bits
Number of I/O — 215
Package Type — 324-BGA
Number of Terminals — 324
Operating Voltage Range — [DATA_NEEDED: operating voltage range]
Maximum Operating Frequency — [DATA_NEEDED: maximum operating frequency]
Operating Temperature Range — [DATA_NEEDED: operating temperature range]
Internal Memory Configuration — [DATA_NEEDED: internal memory configuration]
I/O Standard — [DATA_NEEDED: supported I/O standards]
RoHS Compliance — [DATA_NEEDED: RoHS compliance]
REACH Compliance — [DATA_NEEDED: REACH compliance]
Lead-Free Status — [DATA_NEEDED: lead-free status]

Datasheets & Resources

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