EP3C25F324C7N vs EP3C25F324C7 Vergleich

Detaillierter Direktvergleich von EP3C25F324C7N von Intel und EP3C25F324C7 von Intel. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.

Spezifikationsvergleich

Parameter EP3C25F324C7N EP3C25F324C7
Marke Intel Intel
Kategorie FPGA & CPLD FPGA & CPLD
Lebenszyklusstatus Aktiv Aktiv
Product Type Field Programmable Gate Array (FPGA) —
Device Family Cyclone III —
Logic Cells 24,624 cells —
Embedded Memory 608,256 bits —
Available I/O Pins 215 I/O —
Maximum Listed Frequency 437.5 MHz —
Process Technology 65 nm —
Core Voltage 1.2 V —
Gehäuse 324-ball FBGA —
Terminal Count 324 terminals —
Terminal Form Ball Ball
Package Code BGA BGA
Package Shape Rectangular Square
Montageart Surface Mount Surface Mount
Temperature Grading Other —
Programmability Field programmable —
RoHS-Status [DATA_NEEDED: RoHS status] —
REACH Status [DATA_NEEDED: REACH status] —
AEC-Q100 Qualification [DATA_NEEDED: AEC-Q100 qualification] —
Device Type — Field Programmable Gate Array (FPGA)
FPGA Family — Cyclone III
Logic Elements — 24,624
Memory Bits — 608,256 bits
Number of I/O — 215
Package Type — 324-BGA
Number of Terminals — 324
Operating Voltage Range — [DATA_NEEDED: operating voltage range]
Maximum Operating Frequency — [DATA_NEEDED: maximum operating frequency]
Betriebstemperaturbereich — [DATA_NEEDED: operating temperature range]
Internal Memory Configuration — [DATA_NEEDED: internal memory configuration]
I/O Standard — [DATA_NEEDED: supported I/O standards]
RoHS Compliance — [DATA_NEEDED: RoHS compliance]
REACH Compliance — [DATA_NEEDED: REACH compliance]
Lead-Free Status — [DATA_NEEDED: lead-free status]

Datenblätter & Ressourcen

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