EP3C25F324C7N vs EP3C25F324C7 Pengandingan

Pengandingan Sisi Kiri Sisi Kanan Terperinci EP3C25F324C7N disebabkan oleh Intel dan EP3C25F324C7 disebabkan oleh Intel. Bandingkan spesifikasi utama, parameter elektrik, pakej, status kehidupan, harga, dan keupayaan untuk menentukan komponen terbaik untuk keperluan disenjaya anda.

Pengandingan Spesifikasi

Parametr EP3C25F324C7N EP3C25F324C7
Merek Intel Intel
Kategori FPGA & CPLD FPGA & CPLD
Status Lingkungan Hidup Aktif Aktif
Product Type Field Programmable Gate Array (FPGA) —
Device Family Cyclone III —
Logic Cells 24,624 cells —
Embedded Memory 608,256 bits —
Available I/O Pins 215 I/O —
Maximum Listed Frequency 437.5 MHz —
Process Technology 65 nm —
Core Voltage 1.2 V —
Kemasan 324-ball FBGA —
Terminal Count 324 terminals —
Terminal Form Ball Ball
Package Code BGA BGA
Package Shape Rectangular Square
Jenis Pemasangan Surface Mount Surface Mount
Temperature Grading Other —
Programmability Field programmable —
Status RoHS [DATA_NEEDED: RoHS status] —
REACH Status [DATA_NEEDED: REACH status] —
AEC-Q100 Qualification [DATA_NEEDED: AEC-Q100 qualification] —
Device Type — Field Programmable Gate Array (FPGA)
FPGA Family — Cyclone III
Logic Elements — 24,624
Memory Bits — 608,256 bits
Number of I/O — 215
Package Type — 324-BGA
Number of Terminals — 324
Operating Voltage Range — [DATA_NEEDED: operating voltage range]
Maximum Operating Frequency — [DATA_NEEDED: maximum operating frequency]
Gambaran Suhu Operasi — [DATA_NEEDED: operating temperature range]
Internal Memory Configuration — [DATA_NEEDED: internal memory configuration]
I/O Standard — [DATA_NEEDED: supported I/O standards]
RoHS Compliance — [DATA_NEEDED: RoHS compliance]
REACH Compliance — [DATA_NEEDED: REACH compliance]
Lead-Free Status — [DATA_NEEDED: lead-free status]

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