EP3C55F484C7 vs EP3C55F484C6 Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng EP3C55F484C7 sa pamamagitan ng Intel at EP3C55F484C6 sa pamamagitan ng Intel. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
Pagsanggunian na paghahambing
| Parametro | EP3C55F484C7 | EP3C55F484C6 |
|---|---|---|
| Brand | Intel | Intel |
| Kategorya | FPGA & CPLD | FPGA & CPLD |
| Katayuan ng Lifecycle | Huling Pagbili | Aktibo |
| Device Family | Cyclone III | — |
| Logic Elements (LE) | 55,856 | — |
| Logic Array Blocks (LABs) | 3,495 | — |
| Embedded Memory Bits | 2,396,160 bits | — |
| Embedded Memory (M9K blocks) | 260 blocks of 9 Kbit each | — |
| Embedded 18x18 Multipliers | 156 | 56 |
| Maximum User I/Os | 327 | — |
| PLLs | 4 | — |
| Global Clock Networks | 20 | 20 |
| Internal Operating Frequency (max) | 472 MHz | — |
| Process Technology | 65 nm TSMC low-k CMOS | 65 nm low-power CMOS |
| Core Voltage | 1.2 V | 1.2 V |
| Packhaging | FBGA-484 (FineLine BGA, 23 × 23 mm, 1.0 mm pitch) | 484-FBGA (F484) |
| Operating Temperature Grade | Commercial (0 °C to +85 °C) - C7 speed grade | — |
| Uri ng Pagpapasok | Surface Mount (BGA) | Surface Mount (BGA) |
| Tindminan RoHS | Compliant (lead-free FBGA) | Compliant |
| Configuration Mode | Active Serial (AS), Passive Serial (PS), JTAG | — |
| Configuration Memory Type | SRAM (volatile, requires external flash) | — |
| Family | — | Cyclone III |
| Series | — | EP3C55 |
| Logic Elements | — | 55,856 LE |
| Embedded Memory | — | 2,396,160 bits (2.4 Mbit) |
| Maximum User I/O | — | 327 |
| Speed Grade | — | 6 (commercial) |
| Number of PLLs | — | 4 |
| I/O Banks | — | 8 |
| Supported I/O Standards | — | LVDS, LVTTL, LVCMOS, SSTL, HSTL |
| Configuration | — | JTAG, AS (EPCS), PS, FPP |
| Temperature na Operasyon | — | 0C to +85C (commercial) |