EP3C55F484C7 vs EP3C55F484C6 Pengandingan
Pengandingan Sisi Kiri Sisi Kanan Terperinci EP3C55F484C7 disebabkan oleh Intel dan EP3C55F484C6 disebabkan oleh Intel. Bandingkan spesifikasi utama, parameter elektrik, pakej, status kehidupan, harga, dan keupayaan untuk menentukan komponen terbaik untuk keperluan disenjaya anda.
Intel
EP3C55F484C7 - Cyclone III FPGA, 55K LE, 484-FBGA | Intel
EP3C55F484C7 ⚠ Bahagian terakhir untuk beliPengandingan Spesifikasi
| Parametr | EP3C55F484C7 | EP3C55F484C6 |
|---|---|---|
| Merek | Intel | Intel |
| Kategori | FPGA & CPLD | FPGA & CPLD |
| Status Lingkungan Hidup | Masa Terakhir Dibeli | Aktif |
| Device Family | Cyclone III | — |
| Logic Elements (LE) | 55,856 | — |
| Logic Array Blocks (LABs) | 3,495 | — |
| Embedded Memory Bits | 2,396,160 bits | — |
| Embedded Memory (M9K blocks) | 260 blocks of 9 Kbit each | — |
| Embedded 18x18 Multipliers | 156 | 56 |
| Maximum User I/Os | 327 | — |
| PLLs | 4 | — |
| Global Clock Networks | 20 | 20 |
| Internal Operating Frequency (max) | 472 MHz | — |
| Process Technology | 65 nm TSMC low-k CMOS | 65 nm low-power CMOS |
| Core Voltage | 1.2 V | 1.2 V |
| Kemasan | FBGA-484 (FineLine BGA, 23 × 23 mm, 1.0 mm pitch) | 484-FBGA (F484) |
| Operating Temperature Grade | Commercial (0 °C to +85 °C) - C7 speed grade | — |
| Jenis Pemasangan | Surface Mount (BGA) | Surface Mount (BGA) |
| Status RoHS | Compliant (lead-free FBGA) | Compliant |
| Configuration Mode | Active Serial (AS), Passive Serial (PS), JTAG | — |
| Configuration Memory Type | SRAM (volatile, requires external flash) | — |
| Family | — | Cyclone III |
| Series | — | EP3C55 |
| Logic Elements | — | 55,856 LE |
| Embedded Memory | — | 2,396,160 bits (2.4 Mbit) |
| Maximum User I/O | — | 327 |
| Speed Grade | — | 6 (commercial) |
| Number of PLLs | — | 4 |
| I/O Banks | — | 8 |
| Supported I/O Standards | — | LVDS, LVTTL, LVCMOS, SSTL, HSTL |
| Configuration | — | JTAG, AS (EPCS), PS, FPP |
| Suhu Operasi | — | 0C to +85C (commercial) |