EP3C5F256I7N vs EP3C25F256I7N Comparison
Detailed side-by-side comparison of EP3C5F256I7N by Intel and EP3C25F256I7N by Intel. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.
Specification Comparison
| Parameter | EP3C5F256I7N | EP3C25F256I7N |
|---|---|---|
| Brand | Intel | Intel |
| Category | FPGA & CPLD | FPGA & CPLD |
| Lifecycle Status | Active | Active |
| Stock Status | In Stock | In Stock |
| Unit Price (USD) | $24.00 | $48.90 |
| Family | Cyclone III | Cyclone III |
| Logic Elements | 5,136 | β |
| Total Memory Bits | 423,936 bits | β |
| Embedded Multipliers (18x18) | 26 | 66 |
| PLLs | 2 | 4 |
| Maximum User I/Os | 182 | β |
| Package | 256-FBGA (FineLine BGA) | β |
| Operating Temperature | -40C to +125C (Industrial) | β |
| Supply Voltage - Core | 1.15 V to 1.25 V (typical 1.2 V) | β |
| Process Technology | TSMC 65nm low-power | 65 nm low-power |
| Configuration Modes | Active Serial, Passive Serial, JTAG, FPP | β |
| I/O Standards | LVTTL, LVCMOS, LVDS, SSTL, HSTL | β |
| RoHS Status | Compliant | Lead-Free / RoHS Compliant (per F suffix, 7N suffix) |
| MSL Level | 3 (168 hours) | β |
| Mounting Type | Surface Mount (BGA) | Surface Mount |
| Device Type | β | FPGA - Field Programmable Gate Array |
| Logic Elements (LEs) | β | 24,624 |
| Logic Array Blocks (LABs) | β | 1,539 |
| Embedded Memory Bits | β | 608,256 (66 M9K blocks) |
| Maximum User I/O Pins | β | 156 |
| Core Voltage | β | 1.2 V |
| Package Type | β | 256-LBGA / 256-FBGA (17x17 mm) |
| Operating Temperature Range | β | -40 C to +125 C (Industrial) |
| Speed Grade | β | 7 |