EP3C5F256I7N vs EP3C25F256I7N Pengandingan
Pengandingan Sisi Kiri Sisi Kanan Terperinci EP3C5F256I7N disebabkan oleh Intel dan EP3C25F256I7N disebabkan oleh Intel. Bandingkan spesifikasi utama, parameter elektrik, pakej, status kehidupan, harga, dan keupayaan untuk menentukan komponen terbaik untuk keperluan disenjaya anda.
Pengandingan Spesifikasi
| Parametr | EP3C5F256I7N | EP3C25F256I7N |
|---|---|---|
| Merek | Intel | Intel |
| Kategori | FPGA & CPLD | FPGA & CPLD |
| Status Lingkungan Hidup | Aktif | Aktif |
| Family | Cyclone III | Cyclone III |
| Logic Elements | 5,136 | 24,624 |
| Total Memory Bits | 423,936 bits | — |
| Embedded Multipliers (18x18) | 26 | — |
| PLLs | 2 | 4 general-purpose PLLs |
| Maximum User I/Os | 182 | — |
| Kemasan | 256-FBGA (FineLine BGA) | 256-FBGA (FineLine BGA) |
| Suhu Operasi | -40C to +125C (Industrial) | -40C to +125C |
| Supply Voltage - Core | 1.15 V to 1.25 V (typical 1.2 V) | — |
| Process Technology | TSMC 65nm low-power | 65 nm low-power |
| Configuration Modes | Active Serial, Passive Serial, JTAG, FPP | — |
| I/O Standards | LVTTL, LVCMOS, LVDS, SSTL, HSTL | — |
| Status RoHS | Compliant | Compliant (lead-free) |
| Aras MSL | 3 (168 hours) | — |
| Jenis Pemasangan | Surface Mount (BGA) | Surface Mount |
| Device Type | — | FPGA |
| Embedded Memory | — | 608,256 bits |
| Embedded Multipliers | — | 66 (18x18) |
| Maximum User I/O | — | 156 |
| Core Supply Voltage | — | 1.2 V |
| Speed Grade | — | 7 |
| External Memory Support | — | DDR/DDR2/QDRII/QDRII+ |
| Hot Socketing | — | Supported |
| Configuration | — | SRAM-based, in-system programmable |