EP3C5F256I7N vs EP3C5F256C6N Comparison
Detailed side-by-side comparison of EP3C5F256I7N by Intel and EP3C5F256C6N by Intel. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.
Specification Comparison
| Parameter | EP3C5F256I7N | EP3C5F256C6N |
|---|---|---|
| Brand | Intel | Intel |
| Category | FPGA & CPLD | FPGA & CPLD |
| Lifecycle Status | Active | Active |
| Stock Status | In Stock | In Stock |
| Unit Price (USD) | $24.00 | $18.85 |
| Family | Cyclone III | Cyclone III |
| Logic Elements | 5,136 | β |
| Total Memory Bits | 423,936 bits | 423936 |
| Embedded Multipliers (18x18) | 26 | β |
| PLLs | 2 | 2 |
| Maximum User I/Os | 182 | 182 |
| Package | 256-FBGA (FineLine BGA) | 256-ball FBGA (FineLine BGA), 17 x 17 mm, 1 mm pitch |
| Operating Temperature | -40C to +125C (Industrial) | 0 C to +85 C (commercial "C6" speed grade) |
| Supply Voltage - Core | 1.15 V to 1.25 V (typical 1.2 V) | β |
| Process Technology | TSMC 65nm low-power | β |
| Configuration Modes | Active Serial, Passive Serial, JTAG, FPP | Serial, Parallel, JTAG, AS, PS |
| I/O Standards | LVTTL, LVCMOS, LVDS, SSTL, HSTL | β |
| RoHS Status | Compliant | β |
| MSL Level | 3 (168 hours) | β |
| Mounting Type | Surface Mount (BGA) | Surface Mount |
| Series | β | EP3C5 |
| Logic Elements (LEs) | β | 5136 |
| Logic Array Blocks (LABs) | β | 182 (per DigiKey listing) |
| Embedded 18x18 Multipliers | β | 23 |
| Core Process Technology | β | 65 nm CMOS |
| Core Voltage | β | 1.2 V |
| RoHS / Lead-Free | β | Lead-free (per distributor listings) |