EP3C5F256I7N vs EP3C5F256C6N Pengandingan
Pengandingan Sisi Kiri Sisi Kanan Terperinci EP3C5F256I7N disebabkan oleh Intel dan EP3C5F256C6N disebabkan oleh Intel. Bandingkan spesifikasi utama, parameter elektrik, pakej, status kehidupan, harga, dan keupayaan untuk menentukan komponen terbaik untuk keperluan disenjaya anda.
Pengandingan Spesifikasi
| Parametr | EP3C5F256I7N | EP3C5F256C6N |
|---|---|---|
| Merek | Intel | Intel |
| Kategori | FPGA & CPLD | FPGA & CPLD |
| Status Lingkungan Hidup | Aktif | Aktif |
| Family | Cyclone III | Cyclone III |
| Logic Elements | 5,136 | — |
| Total Memory Bits | 423,936 bits | 423936 |
| Embedded Multipliers (18x18) | 26 | — |
| PLLs | 2 | 2 |
| Maximum User I/Os | 182 | 182 |
| Kemasan | 256-FBGA (FineLine BGA) | 256-ball FBGA (FineLine BGA), 17 x 17 mm, 1 mm pitch |
| Suhu Operasi | -40C to +125C (Industrial) | 0 C to +85 C (commercial "C6" speed grade) |
| Supply Voltage - Core | 1.15 V to 1.25 V (typical 1.2 V) | — |
| Process Technology | TSMC 65nm low-power | — |
| Configuration Modes | Active Serial, Passive Serial, JTAG, FPP | Serial, Parallel, JTAG, AS, PS |
| I/O Standards | LVTTL, LVCMOS, LVDS, SSTL, HSTL | — |
| Status RoHS | Compliant | — |
| Aras MSL | 3 (168 hours) | — |
| Jenis Pemasangan | Surface Mount (BGA) | Surface Mount |
| Series | — | EP3C5 |
| Logic Elements (LEs) | — | 5136 |
| Logic Array Blocks (LABs) | — | 182 (per DigiKey listing) |
| Embedded 18x18 Multipliers | — | 23 |
| Core Process Technology | — | 65 nm CMOS |
| Core Voltage | — | 1.2 V |
| RoHS / Lead-Free | — | Lead-free (per distributor listings) |