EP3C5U256C8N vs EP3C5U256C6N Perbandingan
Perbandingan bersamaan detil EP3C5U256C8N dari Intel dan EP3C5U256C6N dari Intel. Bandingkan spesifikasi penting, parameter listrik, pengemasan, status cycle, harga, dan ketersediaan untuk menentukan komponen terbaik untuk kebutuhan desain Anda.
Perbandingan Spesifikasi
| Parameter Umum | EP3C5U256C8N | EP3C5U256C6N |
|---|---|---|
| Merek | Intel | Intel |
| Kategori | FPGA & CPLD | FPGA & CPLD |
| Status Lingkungan Hidup | Aktif | Aktif |
| Series | Cyclone III | Cyclone III |
| Family Name | Cyclone® III | — |
| Logic Elements (LE) | 5,136 | — |
| Number of CLBs | 5,136 | — |
| Number of Logic Cells | 5,136 | — |
| Total RAM Bits | 423,936 | — |
| Number of I/O | 182 | — |
| Tegangan Pemuat | 1.2 V core, 1.2-3.3 V I/O | — |
| Number of Embedded Multipliers (18x18) | 46 | — |
| Number of PLLs | 4 | — |
| Maximum Operating Frequency | [DATA_NEEDED: maximum operating frequency] | — |
| Speed Grade | 8 (commercial) | C6 |
| Paket | 256-UBGA (Ultra FineLine BGA) | 256-UBGA (Ultra FineLine BGA) |
| Package Dimensions | 14 x 14 mm, 0.8 mm ball pitch | — |
| Tipe Mounting | Surface Mount | Surface Mount (BGA) |
| Lead Free / RoHS | Lead Free, RoHS Compliant | Yes / Compliant |
| Suhu Kerja | 0C to +85C (commercial, "C" suffix) | — |
| Process Technology | 60 nm CMOS, SRAM-based configuration | 60 nm low-power CMOS |
| Device Family | — | Cyclone III FPGA |
| Logic Elements | — | 5,136 |
| Logic Array Blocks (LABs) | — | 321 |
| Embedded Memory | — | 423,936 bits |
| Maximum User I/Os | — | 182 |
| Package Body Size | — | 14 x 14 mm |
| Ball Pitch | — | 0.80 mm |
| Package Height | — | 2.20 mm |
| Operating Temperature Grade | — | Commercial (0C to +85C) |
| Configuration Modes | — | AS, PS, JTAG, Fast Passive Parallel |