EP3C5U256C8N vs EP3C5U256C6N Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng EP3C5U256C8N sa pamamagitan ng Intel at EP3C5U256C6N sa pamamagitan ng Intel. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
Intel
EP3C5U256C6N - Cyclone III FPGA, 5,136 Logic Elements, 256-UBGA | Intel
EP3C5U256C6N ✓ NakahandaPagsanggunian na paghahambing
| Parametro | EP3C5U256C8N | EP3C5U256C6N |
|---|---|---|
| Brand | Intel | Intel |
| Kategorya | FPGA & CPLD | FPGA & CPLD |
| Katayuan ng Lifecycle | Aktibo | Aktibo |
| Series | Cyclone III | Cyclone III |
| Family Name | Cyclone® III | — |
| Logic Elements (LE) | 5,136 | — |
| Number of CLBs | 5,136 | — |
| Number of Logic Cells | 5,136 | — |
| Total RAM Bits | 423,936 | — |
| Number of I/O | 182 | — |
| Volte ng Pagbibigay | 1.2 V core, 1.2-3.3 V I/O | — |
| Number of Embedded Multipliers (18x18) | 46 | — |
| Number of PLLs | 4 | — |
| Maximum Operating Frequency | [DATA_NEEDED: maximum operating frequency] | — |
| Speed Grade | 8 (commercial) | C6 |
| Packhaging | 256-UBGA (Ultra FineLine BGA) | 256-UBGA (Ultra FineLine BGA) |
| Package Dimensions | 14 x 14 mm, 0.8 mm ball pitch | — |
| Uri ng Pagpapasok | Surface Mount | Surface Mount (BGA) |
| Lead Free / RoHS | Lead Free, RoHS Compliant | Yes / Compliant |
| Temperature na Operasyon | 0C to +85C (commercial, "C" suffix) | — |
| Process Technology | 60 nm CMOS, SRAM-based configuration | 60 nm low-power CMOS |
| Device Family | — | Cyclone III FPGA |
| Logic Elements | — | 5,136 |
| Logic Array Blocks (LABs) | — | 321 |
| Embedded Memory | — | 423,936 bits |
| Maximum User I/Os | — | 182 |
| Package Body Size | — | 14 x 14 mm |
| Ball Pitch | — | 0.80 mm |
| Package Height | — | 2.20 mm |
| Operating Temperature Grade | — | Commercial (0C to +85C) |
| Configuration Modes | — | AS, PS, JTAG, Fast Passive Parallel |