EP3CLS200F484C7 vs EP3CLS200F484C8 Pengandingan
Pengandingan Sisi Kiri Sisi Kanan Terperinci EP3CLS200F484C7 disebabkan oleh Intel dan EP3CLS200F484C8 disebabkan oleh Intel. Bandingkan spesifikasi utama, parameter elektrik, pakej, status kehidupan, harga, dan keupayaan untuk menentukan komponen terbaik untuk keperluan disenjaya anda.
Pengandingan Spesifikasi
| Parametr | EP3CLS200F484C7 | EP3CLS200F484C8 |
|---|---|---|
| Merek | Intel | Intel |
| Kategori | FPGA & CPLD | FPGA & CPLD |
| Status Lingkungan Hidup | Aktif | Aktif |
| Family | Cyclone III LS | Cyclone III LS (low-power Cyclone III) |
| Logic Elements (LE) | 198,464 | 198,464 |
| Logic Array Blocks (LABs) | 12,408 | — |
| Embedded Memory (RAM bits) | 8,211,456 | — |
| Maximum User I/Os | 226 | — |
| DSP Blocks | 396 (18x18 multipliers) | — |
| PLLs | 4 | 4 |
| Core Supply Voltage (VCCINT) | 1.2 V | — |
| I/O Supply Voltage (VCCIO) | 1.2 V to 3.3 V | — |
| Kemasan | 484-ball FBGA (F484), 23 x 23 mm, 1.0 mm pitch | 484-pin FBGA (FineLine BGA) |
| Process Technology | CMOS, low-power | 65 nm low-power CMOS |
| Suhu Operasi | 0C to +85C (commercial, C7 speed grade) | 0C to +85C (commercial, 'C' suffix) |
| Configuration Method | JTAG, Passive Serial, Active Serial | — |
| Status RoHS | Compliant | Compliant |
| Jenis Pemasangan | Surface Mount (BGA) | Surface Mount |
| Series | — | Cyclone III LS |
| Logic Array Blocks (LAB) | — | 20,5056 (approx) |
| Embedded Memory | — | 8,211,456 bits (approx 8 Mbit) |
| Embedded 18x18 Multipliers | — | 210 |
| Maximum User I/O | — | 304 |
| I/O Banks | — | 8 |
| Core Voltage | — | 1.2 V |
| Package Dimensions | — | 23 mm x 23 mm, 1.0 mm ball pitch |
| Configuration Modes | — | AS, PS, FPP, JTAG |
| Security | — | Design encryption / bitstream AES |