EP3CLS200F484C7 vs EP3CLS200F484C8 Perbandingan
Perbandingan bersamaan detil EP3CLS200F484C7 dari Intel dan EP3CLS200F484C8 dari Intel. Bandingkan spesifikasi penting, parameter listrik, pengemasan, status cycle, harga, dan ketersediaan untuk menentukan komponen terbaik untuk kebutuhan desain Anda.
Perbandingan Spesifikasi
| Parameter Umum | EP3CLS200F484C7 | EP3CLS200F484C8 |
|---|---|---|
| Merek | Intel | Intel |
| Kategori | FPGA & CPLD | FPGA & CPLD |
| Status Lingkungan Hidup | Aktif | Aktif |
| Family | Cyclone III LS | Cyclone III LS (low-power Cyclone III) |
| Logic Elements (LE) | 198,464 | 198,464 |
| Logic Array Blocks (LABs) | 12,408 | — |
| Embedded Memory (RAM bits) | 8,211,456 | — |
| Maximum User I/Os | 226 | — |
| DSP Blocks | 396 (18x18 multipliers) | — |
| PLLs | 4 | 4 |
| Core Supply Voltage (VCCINT) | 1.2 V | — |
| I/O Supply Voltage (VCCIO) | 1.2 V to 3.3 V | — |
| Paket | 484-ball FBGA (F484), 23 x 23 mm, 1.0 mm pitch | 484-pin FBGA (FineLine BGA) |
| Process Technology | CMOS, low-power | 65 nm low-power CMOS |
| Suhu Kerja | 0C to +85C (commercial, C7 speed grade) | 0C to +85C (commercial, 'C' suffix) |
| Configuration Method | JTAG, Passive Serial, Active Serial | — |
| Status RoHS | Compliant | Compliant |
| Tipe Mounting | Surface Mount (BGA) | Surface Mount |
| Series | — | Cyclone III LS |
| Logic Array Blocks (LAB) | — | 20,5056 (approx) |
| Embedded Memory | — | 8,211,456 bits (approx 8 Mbit) |
| Embedded 18x18 Multipliers | — | 210 |
| Maximum User I/O | — | 304 |
| I/O Banks | — | 8 |
| Core Voltage | — | 1.2 V |
| Package Dimensions | — | 23 mm x 23 mm, 1.0 mm ball pitch |
| Configuration Modes | — | AS, PS, FPP, JTAG |
| Security | — | Design encryption / bitstream AES |