EP3CLS200F484C7N vs EP3CLS200F484C8 Comparison
Detailed side-by-side comparison of EP3CLS200F484C7N by Intel and EP3CLS200F484C8 by Intel. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.
Specification Comparison
| Parameter | EP3CLS200F484C7N | EP3CLS200F484C8 |
|---|---|---|
| Brand | Intel | Intel |
| Category | FPGA & CPLD | FPGA & CPLD |
| Lifecycle Status | Active | Active |
| Stock Status | In Stock | In Stock |
| Unit Price (USD) | $1,650.00 | $118.00 |
| Series | Cyclone III LS | Cyclone III LS |
| Logic Elements (LE) | 198,464 | 198,464 |
| Logic Array Blocks (LAB) | 12,404 | 20,5056 (approx) |
| Embedded Memory | 8,211,456 bits | 8,211,456 bits (approx 8 Mbit) |
| Embedded 18x18 Multipliers | 210 | 210 |
| User I/O | 226 | β |
| Package | 484-ball FBGA (FineLine BGA, 23x23 mm) | 484-pin FBGA (FineLine BGA) |
| Core Voltage | 1.2 V | 1.2 V |
| Operating Temperature | 0C to +85C (commercial) | 0C to +85C (commercial, 'C' suffix) |
| Process Technology | 65 nm low-power CMOS | 65 nm low-power CMOS |
| Configuration Modes | AS, PS, JTAG (IEEE 1149.1) | AS, PS, FPP, JTAG |
| I/O Standards | LVDS, LVTTL, LVCMOS, SSTL, HSTL | β |
| Number of I/O Banks | 8 | β |
| Hot Socketing | Supported | β |
| PLLs | 4 | 4 |
| RoHS Status | Compliant | Compliant |
| Mounting Type | Surface Mount | Surface Mount |
| Family | β | Cyclone III LS (low-power Cyclone III) |
| Maximum User I/O | β | 304 |
| I/O Banks | β | 8 |
| Package Dimensions | β | 23 mm x 23 mm, 1.0 mm ball pitch |
| Security | β | Design encryption / bitstream AES |