EP3CLS200F484C7N vs EP3CLS200F484C8 比較
詳細並排比較 EP3CLS200F484C7N 由 Intel 與 EP3CLS200F484C8 由 Intel. 比較關鍵規格、電氣參數、封裝、生命週期狀態、價格與供貨情況，以找出最符合您設計需求的元件。
規格比較
| 參數 | EP3CLS200F484C7N | EP3CLS200F484C8 |
|---|---|---|
| 品牌 | Intel | Intel |
| 類別 | FPGA & CPLD | FPGA & CPLD |
| 生命週期狀態 | 啟用中 | 啟用中 |
| Series | Cyclone III LS | Cyclone III LS |
| Logic Elements (LE) | 198,464 | 198,464 |
| Logic Array Blocks (LAB) | 12,404 | 20,5056 (approx) |
| Embedded Memory | 8,211,456 bits | 8,211,456 bits (approx 8 Mbit) |
| Embedded 18x18 Multipliers | 210 | 210 |
| User I/O | 226 | — |
| 封裝 | 484-ball FBGA (FineLine BGA, 23x23 mm) | 484-pin FBGA (FineLine BGA) |
| Core Voltage | 1.2 V | 1.2 V |
| 工作溫度 | 0C to +85C (commercial) | 0C to +85C (commercial, 'C' suffix) |
| Process Technology | 65 nm low-power CMOS | 65 nm low-power CMOS |
| Configuration Modes | AS, PS, JTAG (IEEE 1149.1) | AS, PS, FPP, JTAG |
| I/O Standards | LVDS, LVTTL, LVCMOS, SSTL, HSTL | — |
| Number of I/O Banks | 8 | — |
| Hot Socketing | Supported | — |
| PLLs | 4 | 4 |
| RoHS 狀態 | Compliant | Compliant |
| 安裝類型 | Surface Mount | Surface Mount |
| Family | — | Cyclone III LS (low-power Cyclone III) |
| Maximum User I/O | — | 304 |
| I/O Banks | — | 8 |
| Package Dimensions | — | 23 mm x 23 mm, 1.0 mm ball pitch |
| Security | — | Design encryption / bitstream AES |