EP3CLS200F484C7N vs EP3CLS200F484C8 Pengandingan
Pengandingan Sisi Kiri Sisi Kanan Terperinci EP3CLS200F484C7N disebabkan oleh Intel dan EP3CLS200F484C8 disebabkan oleh Intel. Bandingkan spesifikasi utama, parameter elektrik, pakej, status kehidupan, harga, dan keupayaan untuk menentukan komponen terbaik untuk keperluan disenjaya anda.
Pengandingan Spesifikasi
| Parametr | EP3CLS200F484C7N | EP3CLS200F484C8 |
|---|---|---|
| Merek | Intel | Intel |
| Kategori | FPGA & CPLD | FPGA & CPLD |
| Status Lingkungan Hidup | Aktif | Aktif |
| Series | Cyclone III LS | Cyclone III LS |
| Logic Elements (LE) | 198,464 | 198,464 |
| Logic Array Blocks (LAB) | 12,404 | 20,5056 (approx) |
| Embedded Memory | 8,211,456 bits | 8,211,456 bits (approx 8 Mbit) |
| Embedded 18x18 Multipliers | 210 | 210 |
| User I/O | 226 | — |
| Kemasan | 484-ball FBGA (FineLine BGA, 23x23 mm) | 484-pin FBGA (FineLine BGA) |
| Core Voltage | 1.2 V | 1.2 V |
| Suhu Operasi | 0C to +85C (commercial) | 0C to +85C (commercial, 'C' suffix) |
| Process Technology | 65 nm low-power CMOS | 65 nm low-power CMOS |
| Configuration Modes | AS, PS, JTAG (IEEE 1149.1) | AS, PS, FPP, JTAG |
| I/O Standards | LVDS, LVTTL, LVCMOS, SSTL, HSTL | — |
| Number of I/O Banks | 8 | — |
| Hot Socketing | Supported | — |
| PLLs | 4 | 4 |
| Status RoHS | Compliant | Compliant |
| Jenis Pemasangan | Surface Mount | Surface Mount |
| Family | — | Cyclone III LS (low-power Cyclone III) |
| Maximum User I/O | — | 304 |
| I/O Banks | — | 8 |
| Package Dimensions | — | 23 mm x 23 mm, 1.0 mm ball pitch |
| Security | — | Design encryption / bitstream AES |