EP3CLS70F484C8 vs EP3CLS200F484C8 Comparison

Detailed side-by-side comparison of EP3CLS70F484C8 by Intel and EP3CLS200F484C8 by Intel. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.

Specification Comparison

Parameter EP3CLS70F484C8 EP3CLS200F484C8
Brand Intel Intel
Category FPGA & CPLD FPGA & CPLD
Lifecycle Status Active Active
Stock Status In Stock In Stock
Unit Price (USD) $198.00 $118.00
Family Cyclone III LS Cyclone III LS (low-power Cyclone III)
Logic Elements 70,208 β€”
Logic Array Blocks (LABs) 278 β€”
Total Embedded Memory Bits 3,068,928 β€”
Embedded Memory Blocks M9K (4 Kbit each) β€”
Embedded Multipliers (18x18) 300 β€”
Maximum User I/O Pins 278 β€”
PLLs 4 4
Global Clock Networks 20 β€”
Process Technology 65 nm TSMC low-power 65 nm low-power CMOS
Core Supply Voltage 1.2 V β€”
Operating Junction Temperature 0C to +85C (commercial) β€”
Package 484-ball FineLine BGA (FBGA-484) 484-pin FBGA (FineLine BGA)
Bitstream Encryption AES-256 (Cyclone III LS feature) β€”
Configuration Mode Active serial, passive serial, JTAG, fast passive parallel β€”
RoHS Status Compliant Compliant
Lead-Free Yes β€”
Series β€” Cyclone III LS
Logic Elements (LE) β€” 198,464
Logic Array Blocks (LAB) β€” 20,5056 (approx)
Embedded Memory β€” 8,211,456 bits (approx 8 Mbit)
Embedded 18x18 Multipliers β€” 210
Maximum User I/O β€” 304
I/O Banks β€” 8
Core Voltage β€” 1.2 V
Package Dimensions β€” 23 mm x 23 mm, 1.0 mm ball pitch
Configuration Modes β€” AS, PS, FPP, JTAG
Security β€” Design encryption / bitstream AES
Operating Temperature β€” 0C to +85C (commercial, 'C' suffix)
Mounting Type β€” Surface Mount

Datasheets & Resources

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