EP3CLS70F484C8 vs EP3CLS200F484C8 Perbandingan
Perbandingan bersamaan detil EP3CLS70F484C8 dari Intel dan EP3CLS200F484C8 dari Intel. Bandingkan spesifikasi penting, parameter listrik, pengemasan, status cycle, harga, dan ketersediaan untuk menentukan komponen terbaik untuk kebutuhan desain Anda.
Perbandingan Spesifikasi
| Parameter Umum | EP3CLS70F484C8 | EP3CLS200F484C8 |
|---|---|---|
| Merek | Intel | Intel |
| Kategori | FPGA & CPLD | FPGA & CPLD |
| Status Lingkungan Hidup | Aktif | Aktif |
| Family | Cyclone III LS | Cyclone III LS (low-power Cyclone III) |
| Logic Elements | 70,208 | — |
| Logic Array Blocks (LABs) | 278 | — |
| Total Embedded Memory Bits | 3,068,928 | — |
| Embedded Memory Blocks | M9K (4 Kbit each) | — |
| Embedded Multipliers (18x18) | 300 | — |
| Maximum User I/O Pins | 278 | — |
| PLLs | 4 | 4 |
| Global Clock Networks | 20 | — |
| Process Technology | 65 nm TSMC low-power | 65 nm low-power CMOS |
| Core Supply Voltage | 1.2 V | — |
| Suhu Hubung Kerja | 0C to +85C (commercial) | — |
| Paket | 484-ball FineLine BGA (FBGA-484) | 484-pin FBGA (FineLine BGA) |
| Bitstream Encryption | AES-256 (Cyclone III LS feature) | — |
| Configuration Mode | Active serial, passive serial, JTAG, fast passive parallel | — |
| Status RoHS | Compliant | Compliant |
| Lead-Free | Yes | — |
| Series | — | Cyclone III LS |
| Logic Elements (LE) | — | 198,464 |
| Logic Array Blocks (LAB) | — | 20,5056 (approx) |
| Embedded Memory | — | 8,211,456 bits (approx 8 Mbit) |
| Embedded 18x18 Multipliers | — | 210 |
| Maximum User I/O | — | 304 |
| I/O Banks | — | 8 |
| Core Voltage | — | 1.2 V |
| Package Dimensions | — | 23 mm x 23 mm, 1.0 mm ball pitch |
| Configuration Modes | — | AS, PS, FPP, JTAG |
| Security | — | Design encryption / bitstream AES |
| Suhu Kerja | — | 0C to +85C (commercial, 'C' suffix) |
| Tipe Mounting | — | Surface Mount |