EP3CLS70F484C8 vs EP3CLS200F484C8 Pengandingan
Pengandingan Sisi Kiri Sisi Kanan Terperinci EP3CLS70F484C8 disebabkan oleh Intel dan EP3CLS200F484C8 disebabkan oleh Intel. Bandingkan spesifikasi utama, parameter elektrik, pakej, status kehidupan, harga, dan keupayaan untuk menentukan komponen terbaik untuk keperluan disenjaya anda.
Pengandingan Spesifikasi
| Parametr | EP3CLS70F484C8 | EP3CLS200F484C8 |
|---|---|---|
| Merek | Intel | Intel |
| Kategori | FPGA & CPLD | FPGA & CPLD |
| Status Lingkungan Hidup | Aktif | Aktif |
| Family | Cyclone III LS | Cyclone III LS (low-power Cyclone III) |
| Logic Elements | 70,208 | — |
| Logic Array Blocks (LABs) | 278 | — |
| Total Embedded Memory Bits | 3,068,928 | — |
| Embedded Memory Blocks | M9K (4 Kbit each) | — |
| Embedded Multipliers (18x18) | 300 | — |
| Maximum User I/O Pins | 278 | — |
| PLLs | 4 | 4 |
| Global Clock Networks | 20 | — |
| Process Technology | 65 nm TSMC low-power | 65 nm low-power CMOS |
| Core Supply Voltage | 1.2 V | — |
| Suhu Hubungan Operasi | 0C to +85C (commercial) | — |
| Kemasan | 484-ball FineLine BGA (FBGA-484) | 484-pin FBGA (FineLine BGA) |
| Bitstream Encryption | AES-256 (Cyclone III LS feature) | — |
| Configuration Mode | Active serial, passive serial, JTAG, fast passive parallel | — |
| Status RoHS | Compliant | Compliant |
| Lead-Free | Yes | — |
| Series | — | Cyclone III LS |
| Logic Elements (LE) | — | 198,464 |
| Logic Array Blocks (LAB) | — | 20,5056 (approx) |
| Embedded Memory | — | 8,211,456 bits (approx 8 Mbit) |
| Embedded 18x18 Multipliers | — | 210 |
| Maximum User I/O | — | 304 |
| I/O Banks | — | 8 |
| Core Voltage | — | 1.2 V |
| Package Dimensions | — | 23 mm x 23 mm, 1.0 mm ball pitch |
| Configuration Modes | — | AS, PS, FPP, JTAG |
| Security | — | Design encryption / bitstream AES |
| Suhu Operasi | — | 0C to +85C (commercial, 'C' suffix) |
| Jenis Pemasangan | — | Surface Mount |