EP3CLS70F484C8 vs EP3CLS200F484C8 比較

詳細並排比較 EP3CLS70F484C8 由 Intel 與 EP3CLS200F484C8 由 Intel. 比較關鍵規格、電氣參數、封裝、生命週期狀態、價格與供貨情況,以找出最符合您設計需求的元件。

規格比較

參數 EP3CLS70F484C8 EP3CLS200F484C8
品牌 Intel Intel
類別 FPGA & CPLD FPGA & CPLD
生命週期狀態 啟用中 啟用中
Family Cyclone III LS Cyclone III LS (low-power Cyclone III)
Logic Elements 70,208 —
Logic Array Blocks (LABs) 278 —
Total Embedded Memory Bits 3,068,928 —
Embedded Memory Blocks M9K (4 Kbit each) —
Embedded Multipliers (18x18) 300 —
Maximum User I/O Pins 278 —
PLLs 4 4
Global Clock Networks 20 —
Process Technology 65 nm TSMC low-power 65 nm low-power CMOS
Core Supply Voltage 1.2 V —
工作接面溫度 0C to +85C (commercial) —
封裝 484-ball FineLine BGA (FBGA-484) 484-pin FBGA (FineLine BGA)
Bitstream Encryption AES-256 (Cyclone III LS feature) —
Configuration Mode Active serial, passive serial, JTAG, fast passive parallel —
RoHS 狀態 Compliant Compliant
Lead-Free Yes —
Series — Cyclone III LS
Logic Elements (LE) — 198,464
Logic Array Blocks (LAB) — 20,5056 (approx)
Embedded Memory — 8,211,456 bits (approx 8 Mbit)
Embedded 18x18 Multipliers — 210
Maximum User I/O — 304
I/O Banks — 8
Core Voltage — 1.2 V
Package Dimensions — 23 mm x 23 mm, 1.0 mm ball pitch
Configuration Modes — AS, PS, FPP, JTAG
Security — Design encryption / bitstream AES
工作溫度 — 0C to +85C (commercial, 'C' suffix)
安裝類型 — Surface Mount

資料表與資源

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