EP3CLS70F780C7N vs EP3CLS70F780I7N Comparison
Detailed side-by-side comparison of EP3CLS70F780C7N by Intel and EP3CLS70F780I7N by Intel. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.
Intel
EP3CLS70F780I7N - 70,208 Logic Elements FPGA | Intel | Embedded Systems
EP3CLS70F780I7N β ActiveSpecification Comparison
| Parameter | EP3CLS70F780C7N | EP3CLS70F780I7N |
|---|---|---|
| Brand | Intel | Intel |
| Category | FPGA & CPLD | FPGA & CPLD |
| Lifecycle Status | Active | Active |
| Stock Status | In Stock | In Stock |
| Unit Price (USD) | $318.75 | $880.00 |
| Family | Cyclone III LS | β |
| Logic Elements | 70,208 | 70,208 |
| Logic Array Blocks | 47,452 | β |
| Total Memory Bits | 3,068,928 bits | β |
| Embedded Multipliers (18x18) | 200 | β |
| Maximum User I/O | 413 | 413 pins |
| User I/O (this package) | 413 | β |
| Package | 780-ball FBGA (F780) | β |
| Pins/Balls | 780 | β |
| Core Voltage | 1.2 V | β |
| Supply Voltage | 1.2 V | 1.2 V |
| Process Node | 60 nm | β |
| Operating Temperature | 0C to +85C (commercial) | [DATA_NEEDED: operating temperature] |
| Transceivers | 0 (no high-speed transceivers) | β |
| Mounting Type | Surface Mount (BGA) | Surface Mount |
| RoHS Status | Compliant | unknown |
| Device Type | β | Field Programmable Gate Array (FPGA) |
| Series | β | Cyclone III LS |
| Embedded Memory | β | 3,068,928 bits |
| Temperature Grade | β | Industrial |
| Package Type | β | BGA |
| Package Pin Count | β | 780 balls |
| Package Shape | β | Square |
| Terminal Form | β | Ball |
| Configuration Technology | β | SRAM-based FPGA |
| Configuration Method | β | [DATA_NEEDED: configuration method] |
| REACH Status | β | unknown |
| AEC-Q100 Qualification | β | unknown |