EP3CLS70F780C7N vs EP3CLS70F780I7N Pengandingan
Pengandingan Sisi Kiri Sisi Kanan Terperinci EP3CLS70F780C7N disebabkan oleh Intel dan EP3CLS70F780I7N disebabkan oleh Intel. Bandingkan spesifikasi utama, parameter elektrik, pakej, status kehidupan, harga, dan keupayaan untuk menentukan komponen terbaik untuk keperluan disenjaya anda.
Intel
EP3CLS70F780I7N - 70,208 Logic Elements FPGA | Intel | Embedded Systems
EP3CLS70F780I7N ✓ AktifPengandingan Spesifikasi
| Parametr | EP3CLS70F780C7N | EP3CLS70F780I7N |
|---|---|---|
| Merek | Intel | Intel |
| Kategori | FPGA & CPLD | FPGA & CPLD |
| Status Lingkungan Hidup | Aktif | Aktif |
| Family | Cyclone III LS | — |
| Logic Elements | 70,208 | 70,208 |
| Logic Array Blocks | 47,452 | — |
| Total Memory Bits | 3,068,928 bits | — |
| Embedded Multipliers (18x18) | 200 | — |
| Maximum User I/O | 413 | 413 pins |
| User I/O (this package) | 413 | — |
| Kemasan | 780-ball FBGA (F780) | — |
| Pins/Balls | 780 | — |
| Core Voltage | 1.2 V | — |
| Tegangan Pemberi Arus | 1.2 V | 1.2 V |
| Process Node | 60 nm | — |
| Suhu Operasi | 0C to +85C (commercial) | [DATA_NEEDED: operating temperature] |
| Transceivers | 0 (no high-speed transceivers) | — |
| Jenis Pemasangan | Surface Mount (BGA) | Surface Mount |
| Status RoHS | Compliant | unknown |
| Device Type | — | Field Programmable Gate Array (FPGA) |
| Series | — | Cyclone III LS |
| Embedded Memory | — | 3,068,928 bits |
| Temperature Grade | — | Industrial |
| Package Type | — | BGA |
| Package Pin Count | — | 780 balls |
| Package Shape | — | Square |
| Terminal Form | — | Ball |
| Configuration Technology | — | SRAM-based FPGA |
| Configuration Method | — | [DATA_NEEDED: configuration method] |
| REACH Status | — | unknown |
| AEC-Q100 Qualification | — | unknown |