EP3CLS70F780C7N vs EP3CLS70F780I7N Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng EP3CLS70F780C7N sa pamamagitan ng Intel at EP3CLS70F780I7N sa pamamagitan ng Intel. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
Intel
EP3CLS70F780I7N - 70,208 Logic Elements FPGA | Intel | Embedded Systems
EP3CLS70F780I7N ✓ NakahandaPagsanggunian na paghahambing
| Parametro | EP3CLS70F780C7N | EP3CLS70F780I7N |
|---|---|---|
| Brand | Intel | Intel |
| Kategorya | FPGA & CPLD | FPGA & CPLD |
| Katayuan ng Lifecycle | Aktibo | Aktibo |
| Family | Cyclone III LS | — |
| Logic Elements | 70,208 | 70,208 |
| Logic Array Blocks | 47,452 | — |
| Total Memory Bits | 3,068,928 bits | — |
| Embedded Multipliers (18x18) | 200 | — |
| Maximum User I/O | 413 | 413 pins |
| User I/O (this package) | 413 | — |
| Packhaging | 780-ball FBGA (F780) | — |
| Pins/Balls | 780 | — |
| Core Voltage | 1.2 V | — |
| Volte ng Pagbibigay | 1.2 V | 1.2 V |
| Process Node | 60 nm | — |
| Temperature na Operasyon | 0C to +85C (commercial) | [DATA_NEEDED: operating temperature] |
| Transceivers | 0 (no high-speed transceivers) | — |
| Uri ng Pagpapasok | Surface Mount (BGA) | Surface Mount |
| Tindminan RoHS | Compliant | unknown |
| Device Type | — | Field Programmable Gate Array (FPGA) |
| Series | — | Cyclone III LS |
| Embedded Memory | — | 3,068,928 bits |
| Temperature Grade | — | Industrial |
| Package Type | — | BGA |
| Package Pin Count | — | 780 balls |
| Package Shape | — | Square |
| Terminal Form | — | Ball |
| Configuration Technology | — | SRAM-based FPGA |
| Configuration Method | — | [DATA_NEEDED: configuration method] |
| REACH Status | — | unknown |
| AEC-Q100 Qualification | — | unknown |