EP3CLS70F780C7N vs EP3CLS70F780I7N Perbandingan
Perbandingan bersamaan detil EP3CLS70F780C7N dari Intel dan EP3CLS70F780I7N dari Intel. Bandingkan spesifikasi penting, parameter listrik, pengemasan, status cycle, harga, dan ketersediaan untuk menentukan komponen terbaik untuk kebutuhan desain Anda.
Intel
EP3CLS70F780I7N - 70,208 Logic Elements FPGA | Intel | Embedded Systems
EP3CLS70F780I7N ✓ AktifPerbandingan Spesifikasi
| Parameter Umum | EP3CLS70F780C7N | EP3CLS70F780I7N |
|---|---|---|
| Merek | Intel | Intel |
| Kategori | FPGA & CPLD | FPGA & CPLD |
| Status Lingkungan Hidup | Aktif | Aktif |
| Family | Cyclone III LS | — |
| Logic Elements | 70,208 | 70,208 |
| Logic Array Blocks | 47,452 | — |
| Total Memory Bits | 3,068,928 bits | — |
| Embedded Multipliers (18x18) | 200 | — |
| Maximum User I/O | 413 | 413 pins |
| User I/O (this package) | 413 | — |
| Paket | 780-ball FBGA (F780) | — |
| Pins/Balls | 780 | — |
| Core Voltage | 1.2 V | — |
| Tegangan Pemuat | 1.2 V | 1.2 V |
| Process Node | 60 nm | — |
| Suhu Kerja | 0C to +85C (commercial) | [DATA_NEEDED: operating temperature] |
| Transceivers | 0 (no high-speed transceivers) | — |
| Tipe Mounting | Surface Mount (BGA) | Surface Mount |
| Status RoHS | Compliant | unknown |
| Device Type | — | Field Programmable Gate Array (FPGA) |
| Series | — | Cyclone III LS |
| Embedded Memory | — | 3,068,928 bits |
| Temperature Grade | — | Industrial |
| Package Type | — | BGA |
| Package Pin Count | — | 780 balls |
| Package Shape | — | Square |
| Terminal Form | — | Ball |
| Configuration Technology | — | SRAM-based FPGA |
| Configuration Method | — | [DATA_NEEDED: configuration method] |
| REACH Status | — | unknown |
| AEC-Q100 Qualification | — | unknown |