EP3CLS70F780C7N vs EP3CLS70F780I7N 比較
詳細並排比較 EP3CLS70F780C7N 由 Intel 與 EP3CLS70F780I7N 由 Intel. 比較關鍵規格、電氣參數、封裝、生命週期狀態、價格與供貨情況，以找出最符合您設計需求的元件。
規格比較
| 參數 | EP3CLS70F780C7N | EP3CLS70F780I7N |
|---|---|---|
| 品牌 | Intel | Intel |
| 類別 | FPGA & CPLD | FPGA & CPLD |
| 生命週期狀態 | 啟用中 | 啟用中 |
| Family | Cyclone III LS | — |
| Logic Elements | 70,208 | 70,208 |
| Logic Array Blocks | 47,452 | — |
| Total Memory Bits | 3,068,928 bits | — |
| Embedded Multipliers (18x18) | 200 | — |
| Maximum User I/O | 413 | 413 pins |
| User I/O (this package) | 413 | — |
| 封裝 | 780-ball FBGA (F780) | — |
| Pins/Balls | 780 | — |
| Core Voltage | 1.2 V | — |
| 供應電壓 | 1.2 V | 1.2 V |
| Process Node | 60 nm | — |
| 工作溫度 | 0C to +85C (commercial) | [DATA_NEEDED: operating temperature] |
| Transceivers | 0 (no high-speed transceivers) | — |
| 安裝類型 | Surface Mount (BGA) | Surface Mount |
| RoHS 狀態 | Compliant | unknown |
| Device Type | — | Field Programmable Gate Array (FPGA) |
| Series | — | Cyclone III LS |
| Embedded Memory | — | 3,068,928 bits |
| Temperature Grade | — | Industrial |
| Package Type | — | BGA |
| Package Pin Count | — | 780 balls |
| Package Shape | — | Square |
| Terminal Form | — | Ball |
| Configuration Technology | — | SRAM-based FPGA |
| Configuration Method | — | [DATA_NEEDED: configuration method] |
| REACH Status | — | unknown |
| AEC-Q100 Qualification | — | unknown |