EP3SE260F1152C4N vs EP3SE260F1152I4N Comparison

Detailed side-by-side comparison of EP3SE260F1152C4N by Intel and EP3SE260F1152I4N by Intel. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.

Intel
EP3SE260F1152I4N EP3SE260F1152I4N - Stratix III E FPGA, 255K LE, 1152-FCBGA | Intel

EP3SE260F1152I4N - Stratix III E FPGA, 255K LE, 1152-FCBGA | Intel

EP3SE260F1152I4N ⚠ Last Time Buy

Specification Comparison

Parameter EP3SE260F1152C4N EP3SE260F1152I4N
Brand Intel Intel
Category FPGA & CPLD FPGA & CPLD
Lifecycle Status Obsolete Last_time_buy
Stock Status In Stock In Stock
Unit Price (USD) $1,620.00 $2,050.00
Series Stratix III E Stratix III E
Family Stratix III (Enhanced) β€”
Logic Elements (LEs) 255,000 β€”
Embedded Memory 16,672,768 bits (16.67 Mbit) β€”
Maximum User I/Os 744 β€”
Number of LABs/CLBs 10,200 β€”
DSP / 18x18 Multipliers 768 embedded multipliers β€”
Process Technology 65 nm CMOS TSMC 40 nm
Core Voltage 1.1 V 0.86 V
Maximum Operating Frequency 450 MHz β€”
Package 1152-ball FC-FBGA (flip-chip) 1152-ball FCBGA (35 mm x 35 mm)
Speed Grade -4 (commercial temperature) 4
Operating Temperature 0C to +85C (commercial, 'C' suffix) -40C to +100C (Industrial)
Mounting Type Surface Mount (BGA) Surface Mount
Packaging Tray β€”
Lead-Free / RoHS Lead-free finish (RoHS compliant per distributor listing) β€”
Memory Type SRAM-based, volatile (requires configuration device) β€”
Configuration External EPCS / enhanced configuration via AS, PS, JTAG, or FPP β€”
Product Status Obsolete (per Xecor cross-reference data) β€”
Logic Elements β€” 255,000
Embedded Memory (bits) β€” 16,672,768
Logic Array Blocks (LABs) β€” 10,200
Maximum User I/O β€” 744
DSP Blocks (18x18 multipliers) β€” 896
Transceivers β€” 48 (up to 8.5 Gbps)
MSL Level β€” 3 (168 hours)
RoHS Status β€” Compliant

Datasheets & Resources

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